{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T20:20:19Z","timestamp":1740169219395,"version":"3.37.3"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"Hubei Provincial Major Program of Technological Innovation","award":["2017AAA121"],"award-info":[{"award-number":["2017AAA121"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/access.2021.3102830","type":"journal-article","created":{"date-parts":[[2021,8,5]],"date-time":"2021-08-05T20:08:52Z","timestamp":1628194132000},"page":"109548-109557","source":"Crossref","is-referenced-by-count":1,"title":["Failure Analysis of Aluminum Wire Bonds in Automotive Pressure Sensors in Thermal Shock Environments"],"prefix":"10.1109","volume":"9","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1257-4947","authenticated-orcid":false,"given":"Jun","family":"Yang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Panpan","family":"Zheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaogang","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qinglin","family":"Song","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yingfeng","family":"Zhu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bin","family":"Song","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoping","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheng","family":"Liu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref30","first-page":"73","article-title":"Life prediction of bonding interface in power module under thermal cycling loading","volume":"35","author":"guo","year":"2017","journal-title":"Mechanical and electronics engineering"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(00)00139-6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.06.089"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.03.002"},{"journal-title":"Test method standard microcircuits","year":"2017","key":"ref13"},{"journal-title":"Wire Bond Shear Test Method","year":"2017","key":"ref14"},{"journal-title":"Wire Bond Shear Test Automotive Electronics Council Component Technical Committee","year":"2014","key":"ref15"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/AMR.925.154"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/33.58865"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.095"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2018.03.028"},{"journal-title":"ANSYS Mechanical User's Guide","year":"2012","key":"ref28"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.matchemphys.2012.07.036"},{"journal-title":"Heraeus ALW-49P","year":"2021","key":"ref27"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-009-0951-8"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/BF02690530"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.172"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/BF02652917"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.10.009"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"44","DOI":"10.1109\/TDMR.2003.814408","article-title":"Failure mechanisms of aluminum bondpad peeling during thermosonic bonding","volume":"3","author":"tan","year":"2003","journal-title":"IEEE Trans Device Mater Rel"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(00)00130-X"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(98)00141-3"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2018.06.061"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2011.06.048"},{"key":"ref22","first-page":"236","article-title":"The research on respiration effect","volume":"7","author":"gong","year":"2009","journal-title":"Radar Sci Technol"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(01)00236-0"},{"journal-title":"Modeling and Simulation for Microelectronic Packaging Assembly","year":"2012","author":"liu","key":"ref24"},{"journal-title":"Bosch Automotive Handbook","year":"2009","author":"wei","key":"ref23"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.1991.163982"},{"journal-title":"Environmental Testing–Part 2-14 Tests–Test N Change of Temperature International Electrotechnical Commission Edition 6 0","year":"2009","key":"ref25"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9312710\/09507347.pdf?arnumber=9507347","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,26]],"date-time":"2022-01-26T21:36:10Z","timestamp":1643232970000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9507347\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/access.2021.3102830","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2021]]}}}