{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,11]],"date-time":"2026-03-11T22:29:05Z","timestamp":1773268145451,"version":"3.50.1"},"reference-count":47,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2021,1,1]],"date-time":"2021-01-01T00:00:00Z","timestamp":1609459200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea (NRF) grant funded by the Korea government","doi-asserted-by":"publisher","award":["2020R1A2C2003500"],"award-info":[{"award-number":["2020R1A2C2003500"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea grant funded by the Ministry of Science and ICT for Original Technology Program","doi-asserted-by":"publisher","award":["2020M3F3A2A01082329"],"award-info":[{"award-number":["2020M3F3A2A01082329"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"Super Computer Development Leading Program of the National Research Foundation of Korea funded by the Korean government","doi-asserted-by":"publisher","award":["2020M3H6A1084852"],"award-info":[{"award-number":["2020M3H6A1084852"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100004358","name":"Samsung Electronics Co., Ltd","doi-asserted-by":"publisher","award":["IO201212-08130-01"],"award-info":[{"award-number":["IO201212-08130-01"]}],"id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002642","name":"College of Information, Korea University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002642","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2021]]},"DOI":"10.1109\/access.2021.3108628","type":"journal-article","created":{"date-parts":[[2021,8,30]],"date-time":"2021-08-30T21:09:12Z","timestamp":1630357752000},"page":"120715-120729","source":"Crossref","is-referenced-by-count":5,"title":["Characterizing the Thermal Feasibility of Monolithic 3D Microprocessors"],"prefix":"10.1109","volume":"9","author":[{"given":"Ji Heon","family":"Lee","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9137-8217","authenticated-orcid":false,"given":"Young Seo","family":"Lee","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6918-0236","authenticated-orcid":false,"given":"Jeong Hwan","family":"Choi","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5649-3102","authenticated-orcid":false,"given":"Hussam","family":"Amrouch","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9013-9561","authenticated-orcid":false,"given":"Joonho","family":"Kong","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8270-7875","authenticated-orcid":false,"given":"Young-Ho","family":"Gong","sequence":"additional","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5347-9586","authenticated-orcid":false,"given":"Sung Woo","family":"Chung","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2019.8824802"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2164540"},{"key":"ref33","year":"2016","journal-title":"Kraken X52"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2144596"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105405"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2007.891300"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317880"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2007.346197"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.284"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2019.8824947"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593140"},{"key":"ref11","first-page":"144","article-title":"Lakefield and mobility compute: A 3D stacked 10 nm and 22 FFL hybrid processor system in $12\\times12$\n mm2, 1 mm package-on-package","author":"gomes","year":"2020","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3054021"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2019.2894982"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/3307650.3322233"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.64"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2016.7783764"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/HOTCHIPS.2019.8875654"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1186736.1186737"},{"key":"ref19","year":"2016","journal-title":"E97379-003"},{"key":"ref28","author":"lee","year":"2017","journal-title":"Thermoelectrics Design and materials"},{"key":"ref4","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1145\/2024716.2024718","article-title":"The gem5 simulator","volume":"39","author":"binkert","year":"2011","journal-title":"ACM SIGARCH Comput Archit News"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/2187671.2187675"},{"key":"ref3","year":"2017","journal-title":"Intelligent power allocation"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2006.18"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"key":"ref5","first-page":"331","article-title":"Fighting fire with fire: Modeling the datacenter-scale effects of targeted superlattice thermal management","author":"biswas","year":"2011","journal-title":"2011 38th Annual International Symposium on Computer Architecture (ISCA) ISCA"},{"key":"ref8","year":"2013","journal-title":"V8 GTS"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA45697.2020.00037"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2019.2916869"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2017.43"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/3123939.3124547"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.067"},{"key":"ref20","year":"2015","journal-title":"Intel Core I7-6700 Processor"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/TMSCS.2018.2882433"},{"key":"ref22","year":"2020","journal-title":"Intel Core i9-10900K Processor"},{"key":"ref47","article-title":"Hotspot 6.0: Validation, acceleration and extension","author":"zhang","year":"2015"},{"key":"ref21","year":"2015","journal-title":"Intel Core I7 Processor"},{"key":"ref42","first-page":"2","article-title":"A 14 nm FinFET transistor-level 3D partitioning design to enable high-performance and low-cost monolithic 3D IC","author":"shi","year":"2016","journal-title":"IEDM Tech Dig"},{"key":"ref24","year":"2015","journal-title":"The compute architecture of Intel processor graphics Gen9"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2019.00054"},{"key":"ref23","year":"2017","journal-title":"Intel Performance Counter Monitor–a Better Way to Measure CPU Utilization"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3079166"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2018.2822683"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/ICPPW.2012.39"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2009.5413115"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9312710\/09524684.pdf?arnumber=9524684","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,12,17]],"date-time":"2021-12-17T19:57:42Z","timestamp":1639771062000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9524684\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021]]},"references-count":47,"URL":"https:\/\/doi.org\/10.1109\/access.2021.3108628","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021]]}}}