{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,12]],"date-time":"2026-03-12T15:43:45Z","timestamp":1773330225205,"version":"3.50.1"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"name":"Postgraduate Research and Practice Innovation Program of Jiangsu Province","award":["KYCX21_2229"],"award-info":[{"award-number":["KYCX21_2229"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2022]]},"DOI":"10.1109\/access.2022.3163313","type":"journal-article","created":{"date-parts":[[2022,3,30]],"date-time":"2022-03-30T19:52:41Z","timestamp":1648669961000},"page":"35605-35619","source":"Crossref","is-referenced-by-count":12,"title":["Improved Temperature Monitoring and Protection Method of Three-Level NPC Application Based on Half-Bridge IGBT Modules"],"prefix":"10.1109","volume":"10","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5157-8801","authenticated-orcid":false,"given":"Qiang","family":"Wang","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, China University of Mining and Technology, Xuzhou, China"}]},{"given":"Jingwei","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, China University of Mining and Technology, Xuzhou, China"}]},{"given":"Francesco","family":"Iannuzzo","sequence":"additional","affiliation":[{"name":"Center of Reliable Power Electronics (CORPE), Aalborg University (AAU), Aalborg, Denmark"}]},{"given":"Amir Sajjad","family":"Bahman","sequence":"additional","affiliation":[{"name":"Center of Reliable Power Electronics (CORPE), Aalborg University (AAU), Aalborg, Denmark"}]},{"given":"Weifeng","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, China University of Mining and Technology, Xuzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5341-3955","authenticated-orcid":false,"given":"Fengyou","family":"He","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, China University of Mining and Technology, Xuzhou, China"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"Infineon IGBT Module Data Sheet","year":"1999"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2682114"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3002188"},{"key":"ref4","first-page":"1","article-title":"Over-temperature protection for IGBT modules","volume-title":"Proc. Int. Exhib. Conf. Power Electron., Intell. Motion, Renew. Energy Manage.","author":"Wang"},{"key":"ref5","first-page":"1","article-title":"Lifetime evaluation of inverter IGBT modules for electric vehicles mission-profile","volume-title":"Proc. 19th Int. Conf. Electr. Mach. Syst. (ICEMS)","author":"Qiu"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3103159"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2982223"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2020.3030753"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2893455"},{"key":"ref10","first-page":"1","article-title":"Impact of kelvin-source resistors on current sharing and failure detection in multichip power modules","volume-title":"Proc. 20th Eur. Conf. Power Electron. Appl. (EPE ECCE Europe)","author":"Baker"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2950311"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3024815"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3022390"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2020.2984997"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.3006449"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2020.2981806"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2694548"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JESTPE.2016.2531631"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2014.2352341"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2501540"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/APEC.2018.8341428"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.3390\/electronics10020194"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TENCONSpring.2018.8692058"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2997676"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/PEAC.2018.8590329"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2012.06.013"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2942326"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2022.3150092"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/IFEEC47410.2019.9014927"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/CIYCEE49808.2020.9332697"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9668973\/09745121.pdf?arnumber=9745121","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,18]],"date-time":"2024-01-18T00:17:04Z","timestamp":1705537024000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9745121\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/access.2022.3163313","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022]]}}}