{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,17]],"date-time":"2025-04-17T01:14:11Z","timestamp":1744852451362,"version":"3.37.3"},"reference-count":31,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/100016280","name":"L3Harris Technologies","doi-asserted-by":"publisher","award":["10.13039\/100016280"],"award-info":[{"award-number":["10.13039\/100016280"]}],"id":[{"id":"10.13039\/100016280","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2022]]},"DOI":"10.1109\/access.2022.3179495","type":"journal-article","created":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T19:46:01Z","timestamp":1654112761000},"page":"58921-58929","source":"Crossref","is-referenced-by-count":1,"title":["Additive-Manufactured, Highly-Conductive Metasurfaces, With Application Enabling Secondary Properties, for Microwave Waveguide Components"],"prefix":"10.1109","volume":"10","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1934-1759","authenticated-orcid":false,"given":"Richard G.","family":"Edwards","sequence":"first","affiliation":[{"name":"L3Harris Communication Systems, Salt Lake City, UT, USA"}]},{"given":"Isaac","family":"Krieger","sequence":"additional","affiliation":[{"name":"Material Science and Engineering Department, The University of Utah, Salt Lake City, UT, USA"}]},{"given":"Mark P.","family":"Halling","sequence":"additional","affiliation":[{"name":"Material Science and Engineering Department, The University of Utah, Salt Lake City, UT, USA"}]},{"given":"Shelley D.","family":"Minteer","sequence":"additional","affiliation":[{"name":"Chemistry Department, The University of Utah, Salt Lake City, UT, USA"}]},{"given":"Taylor D.","family":"Sparks","sequence":"additional","affiliation":[{"name":"Material Science and Engineering Department, The University of Utah, Salt Lake City, UT, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2000-6966","authenticated-orcid":false,"given":"David","family":"Schurig","sequence":"additional","affiliation":[{"name":"Electrical and Computer Engineering Department, The University of Utah, Salt Lake City, UT, USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1698368"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2695192"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8058615"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.23919\/EuCAP.2017.7928732"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2005.02.048"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1002\/adma.200700797"},{"key":"ref7","first-page":"108","article-title":"Creating complex hollow metal geometries using additive manufacturing and electroforming","volume-title":"Proc. Int. Solid Freeform Fabr. Symp.","author":"McCarthy"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2016.2625098"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/S0007-8506(07)60395-3"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1108\/13552549810222939"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2010.09.019"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-021-01744-9"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1049\/iet-map.2017.0151"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1364\/AOP.11.000380"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1002\/smtd.201600064"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.physrep.2016.04.004"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.94.075142"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.1602714"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1088\/2040-8986\/ab161d"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2008.2011147"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1049\/iet-map.2010.0089"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2732983"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2011.2182638"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2016.2597221"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevE.70.016608"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevE.71.036617"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISFA.2016.7790182"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1002\/nme.2579"},{"volume-title":"Material Property Data","year":"2016","key":"ref29"},{"volume-title":"Field and Wave Electrodynamics","year":"1965","author":"Johnson","key":"ref30"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3071486"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9668973\/09785981.pdf?arnumber=9785981","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T02:38:05Z","timestamp":1706755085000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9785981\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/access.2022.3179495","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2022]]}}}