{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,9]],"date-time":"2026-07-09T15:20:25Z","timestamp":1783610425301,"version":"3.55.0"},"reference-count":47,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea through the Korean Government Ministry of Science and Information and Communication Technologies (ICT)","doi-asserted-by":"publisher","award":["NRF-2021R1A2B5B01001721"],"award-info":[{"award-number":["NRF-2021R1A2B5B01001721"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2022]]},"DOI":"10.1109\/access.2022.3182552","type":"journal-article","created":{"date-parts":[[2022,6,13]],"date-time":"2022-06-13T20:37:15Z","timestamp":1655152635000},"page":"62137-62156","source":"Crossref","is-referenced-by-count":18,"title":["Deep Learning-Assisted Power Minimization in Underlay MISO-SWIPT Systems Based On Rate-Splitting Multiple Access"],"prefix":"10.1109","volume":"10","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1953-872X","authenticated-orcid":false,"given":"Mario R.","family":"Camana","sequence":"first","affiliation":[{"name":"Department of Electrical, Electronic and Computer Engineering, University of Ulsan, Ulsan, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4692-253X","authenticated-orcid":false,"given":"Carla E.","family":"Garcia","sequence":"additional","affiliation":[{"name":"Department of Electrical, Electronic and Computer Engineering, University of Ulsan, Ulsan, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7476-8782","authenticated-orcid":false,"given":"Insoo","family":"Koo","sequence":"additional","affiliation":[{"name":"Department of Electrical, Electronic and Computer Engineering, University of Ulsan, Ulsan, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2016.7470942"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1186\/s13638-018-1104-7"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LWC.2019.2954518"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VTC2020-Fall49728.2020.9348672"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2892321"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2018.2872375"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2017.2783901"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/MCOM.2015.7081084"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2014.041714.131688"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICC.2016.7511628"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2017.2785861"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2019.2900634"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ICC.2017.7996560"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSYST.2019.2904721"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2015.2498928"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1137\/1.9781611970777"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2016.2619340"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2017.2727073"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.3390\/electronics9111948"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2018.2824622"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2020.08.082"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2016.2591501"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2016.2543212"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2019.2943168"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISWCS.2018.8491100"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2021.3133433"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/SPAWC.2019.8815494"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/LCOMM.2019.2892109"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/s11276-019-02126-z"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSYST.2020.3032725"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/MWC.2019.1800350"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2019.2957798"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/MWC.010.2100117"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2018.2866382"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ICCChina.2018.8641220"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2019.2960361"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-94463-0"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/MSP.2010.936019"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1007\/0-387-30528-9_7"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1017\/CBO9780511804441"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2012.2189857"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.3390\/electronics9081222"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2014.2354312"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1002\/0471671746"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3162838"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-61111-8"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2007.897903"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9668973\/09794750.pdf?arnumber=9794750","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T02:40:24Z","timestamp":1706755224000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9794750\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022]]},"references-count":47,"URL":"https:\/\/doi.org\/10.1109\/access.2022.3182552","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022]]}}}