{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,10]],"date-time":"2026-03-10T14:50:57Z","timestamp":1773154257790,"version":"3.50.1"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2022,1,1]],"date-time":"2022-01-01T00:00:00Z","timestamp":1640995200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Special Foundation through the Project \u2018\u2018Key Technologies of 224 Gbps CNRZ-7 Transceiver Oriented to Core Interconnect\u2019\u2019","doi-asserted-by":"publisher","award":["2022T150781"],"award-info":[{"award-number":["2022T150781"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002858","name":"China Postdoctoral Science Foundation through the Project \u2018\u2018Research on Key Technologies of High Speed SerDes Chip for 10E Supercomputer IO\u2019\u2019","doi-asserted-by":"publisher","award":["2020M673697"],"award-info":[{"award-number":["2020M673697"]}],"id":[{"id":"10.13039\/501100002858","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2022]]},"DOI":"10.1109\/access.2022.3204744","type":"journal-article","created":{"date-parts":[[2022,9,6]],"date-time":"2022-09-06T19:24:51Z","timestamp":1662492291000},"page":"96556-96567","source":"Crossref","is-referenced-by-count":7,"title":["A CNRZ-7 Based Wireline Transceiver With High-Bandwidth-Density, Low-Power for D2D Communication"],"prefix":"10.1109","volume":"10","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2101-3244","authenticated-orcid":false,"given":"Geng","family":"Zhang","sequence":"first","affiliation":[{"name":"School of Computer, National University of Defense Technology, Changsha, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mingche","family":"Lai","sequence":"additional","affiliation":[{"name":"School of Computer, National University of Defense Technology, Changsha, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fangxu","family":"Lyu","sequence":"additional","affiliation":[{"name":"School of Computer, National University of Defense Technology, Changsha, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8978-6825","authenticated-orcid":false,"given":"Xuqiang","family":"Zheng","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics of Chinese Academy of Sciences, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Heming","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Air and Missile Defense College, Air Force Engineering University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dongbin","family":"Lv","sequence":"additional","affiliation":[{"name":"School of Air and Missile Defense College, Air Force Engineering University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chaolong","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Computer, National University of Defense Technology, Changsha, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xingyun","family":"Qi","sequence":"additional","affiliation":[{"name":"School of Computer, National University of Defense Technology, Changsha, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qing","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Air and Missile Defense College, Air Force Engineering University, Xi&#x2019;an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"1","article-title":"A 256 Gb\/s\/mm-shoreline AIB-compatible 16 nm FinFET CMOS chiplet for 2.5 D integration with stratix 10 FPGA on EMIB and tiling on silicon interposer","author":"liu","year":"2021","journal-title":"Proc CICC"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960207"},{"key":"ref12","year":"2022","journal-title":"Universal Chiplet Interconnect Express (UCIe) Specification Revision 1 0"},{"key":"ref13","first-page":"1103","article-title":"A 1.02 pJ\/b 417 Gb\/s\/mm USR link in 16 nm FinFET","author":"tajalli","year":"2019","journal-title":"Proc Symp VLSI Circuits"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2019.2910615"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/SPI52361.2021.9505183"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS50281.2020.9312903"},{"key":"ref17","first-page":"182","article-title":"A pin-efficient 20.83 Gb\/s\/wire 0.94 pJ\/bit forwarded clock CNRZ-5 -coded SerDes up to 12 mm for MCM packages in 28 nm CMOS","author":"shokrollahi","year":"2016","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2962655"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/IGARSS.2016.7730340"},{"key":"ref4","first-page":"181","article-title":"A 26.5625-to-106.25 Gb\/s XSR SerDes with 1.55 pJ\/b efficiency in 7 nm CMOS","author":"shivnaraine","year":"2021","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref3","first-page":"122","article-title":"A 1.6 Tb\/s chiplet over XSR-MCM channels using 113 Gb\/s PAM-4 transceiver with dynamic receiver-driven adaptation of TX-FFE and programmable roaming taps in 5 nm CMOS","author":"gangasani","year":"2022","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECOC.2018.8535467"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JPHOT.2019.2954597"},{"key":"ref8","first-page":"1","article-title":"56 Gbps PAM4 SerDes link parameter optimization for improved post-FEC BER","author":"ahn","year":"2019","journal-title":"Proc IEEE 28th Conf Electr Perform Electron Packag Syst (EPEPS)"},{"key":"ref7","first-page":"138","article-title":"A 112 Gb\/s ADC-DSP-based PAM-4 transceiver for long-reach applications with >40dB channel loss in 7 nm FinFET","author":"mishra","year":"2021","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/HOTI.2019.00020"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VTS48691.2020.9107636"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2020.3040410"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.1988.15444"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/68.205619"},{"key":"ref21","first-page":"504","article-title":"A novel complete set of Walsh and inverse Walsh transforms for signal processing","author":"abbasi","year":"2011","journal-title":"Proc Int Conf Commun Syst Netw Technol"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310291"},{"key":"ref23","first-page":"108","article-title":"A fully adaptive 19-to-56 Gb\/s PAM-4 wireline transceiver with a configurable ADC in 16 nm FinFET","author":"upadhyaya","year":"2018","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/9668973\/09878332.pdf?arnumber=9878332","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,9,22]],"date-time":"2022-09-22T20:09:28Z","timestamp":1663877368000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9878332\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/access.2022.3204744","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022]]}}}