{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T20:21:49Z","timestamp":1740169309954,"version":"3.37.3"},"reference-count":36,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/501100001691","name":"Japan Society for the Promotion of Science (JSPS) KAKENHI","doi-asserted-by":"publisher","award":["19H02188"],"award-info":[{"award-number":["19H02188"]}],"id":[{"id":"10.13039\/501100001691","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2023]]},"DOI":"10.1109\/access.2023.3296429","type":"journal-article","created":{"date-parts":[[2023,7,18]],"date-time":"2023-07-18T17:44:11Z","timestamp":1689702251000},"page":"74364-74378","source":"Crossref","is-referenced-by-count":1,"title":["Integrated Imager and 3.22 <i>\u03bc<\/i>s\/Kernel-Latency All-Digital In-Imager Global-Parallel Binary Convolutional Neural Network Accelerator for Image Processing"],"prefix":"10.1109","volume":"11","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9732-6768","authenticated-orcid":false,"given":"Ruizhi","family":"Wang","sequence":"first","affiliation":[{"name":"Institute of Industrial Science, The University of Tokyo, Tokyo, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cheng-Hsuan","family":"Wu","sequence":"additional","affiliation":[{"name":"Institute of Industrial Science, The University of Tokyo, Tokyo, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0289-7790","authenticated-orcid":false,"given":"Makoto","family":"Takamiya","sequence":"additional","affiliation":[{"name":"Institute of Industrial Science, The University of Tokyo, Tokyo, Japan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref13","first-page":"154","article-title":"A 1\/2.3inch 12.3 Mpixel with on-chip 4.97TOPS\/W CNN processor back-illuminated stacked CMOS image sensor","author":"eki","year":"2021","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870268"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3034192"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2019.2939357"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2020.3028766"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JXCDC.2022.3210509"},{"key":"ref36","first-page":"1","article-title":"A 6.9 ?m pixel-pitch 3D stacked global shutter CMOS image sensor with 3M cu-cu connections","author":"miura","year":"2019","journal-title":"Proc IEEE Int'l 3D Systems Integration Conf (3DIC)"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-022-34230-8"},{"key":"ref30","first-page":"15","article-title":"DNN accelerator architectures","author":"emer","year":"2019","journal-title":"Proc Int Symp Comput Archit (ISCA) Tutorial"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2937227"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.3390\/electronics11060937"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3090668"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.3390\/s19010140"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.2995135"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3034351"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/3461342"},{"journal-title":"How Fast Is Realtime? Human Perception and Technology","year":"2015","author":"burger","key":"ref16"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3162066"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-11179-7_36"},{"key":"ref24","first-page":"82","article-title":"A 1ms high-speed vision chip with 3D-stacked 140GOPS column-parallel PEs for spatio-temporal image processing","author":"yamazaki","year":"2017","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.3390\/photonics6020073"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2939888"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2642198"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2757036"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/3020078.3021727"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870353"},{"key":"ref28","article-title":"Eyeriss v2: A flexible accelerator for emerging deep neural networks on mobile devices","author":"chen","year":"2018","journal-title":"arXiv 1807 07928"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2616357"},{"key":"ref29","first-page":"171","article-title":"The future of stack computers","author":"koopman","year":"1989","journal-title":"Stack Computers The New Wave"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2019.00142"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-00501-9"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365839"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3028848"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3020286"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2869150"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.2976099"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/10005208\/10185926.pdf?arnumber=10185926","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,12,11]],"date-time":"2024-12-11T02:09:05Z","timestamp":1733882945000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10185926\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023]]},"references-count":36,"URL":"https:\/\/doi.org\/10.1109\/access.2023.3296429","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2023]]}}}