{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T00:20:13Z","timestamp":1773793213716,"version":"3.50.1"},"reference-count":38,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/access.2024.3351759","type":"journal-article","created":{"date-parts":[[2024,1,9]],"date-time":"2024-01-09T15:37:56Z","timestamp":1704814676000},"page":"7853-7863","source":"Crossref","is-referenced-by-count":2,"title":["Microstructure and Microhardness of Conical-Shaped W-Cu Composites Prepared by Spark Plasma Sintering and Subsequent Spinning Process"],"prefix":"10.1109","volume":"12","author":[{"given":"Nguyen Minh","family":"Tuan","sequence":"first","affiliation":[{"name":"Institute of Materials Science, Vietnam Academy of Science and Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7801-5155","authenticated-orcid":false,"given":"Nguyen","family":"Van Toan","sequence":"additional","affiliation":[{"name":"Institute of Materials Science, Vietnam Academy of Science and Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Luong","family":"Van Duong","sequence":"additional","affiliation":[{"name":"Institute of Materials Science, Vietnam Academy of Science and Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vu Thang","family":"Long","sequence":"additional","affiliation":[{"name":"Institute of Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tran Bao","family":"Trung","sequence":"additional","affiliation":[{"name":"Institute of Materials Science, Vietnam Academy of Science and Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7905-3647","authenticated-orcid":false,"given":"Pham","family":"Van Trinh","sequence":"additional","affiliation":[{"name":"Institute of Materials Science, Vietnam Academy of Science and Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Doan Dinh","family":"Phuong","sequence":"additional","affiliation":[{"name":"Institute of Materials Science, Vietnam Academy of Science and Technology, Hanoi, Vietnam"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2018.03.014"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41427-019-0179-x"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/33.76502"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2022.109664"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2013.12.004"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2018.03.015"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2016.10.310"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2018.06.338"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2022.165246"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1179\/143307510x12820854748638"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2015.10.057"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2018.06.061"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1007\/s11106-017-9884-6"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2009.12.011"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.jnucmat.2013.06.011"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2022.105857"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.13005\/ojc\/350201"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1186\/2228-5547-3-10"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2008.01.001"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2007.10.048"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2007.08.042"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2007.08.080"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2007.06.005"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1007\/s10853-006-1039-y"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2015.03.183"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijrmhm.2019.02.015"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.apt.2020.07.015"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2019.01.274"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1016\/j.powtec.2012.01.005"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2022.11.235"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijlmm.2020.06.006"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2014.05.005"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2009.07.006"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2009.08.021"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1016\/j.solidstatesciences.2010.11.024"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1016\/b978-0-323-90912-9.00023-x"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1007\/s10853-019-04160-w"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.2211190207"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/10380310\/10385057.pdf?arnumber=10385057","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,17]],"date-time":"2026-03-17T20:24:47Z","timestamp":1773779087000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10385057\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":38,"URL":"https:\/\/doi.org\/10.1109\/access.2024.3351759","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]}}}