{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,3]],"date-time":"2026-07-03T20:49:42Z","timestamp":1783111782163,"version":"3.54.6"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100003661","name":"Korea Institute for Advancement of Technology (KIAT) grant","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003661","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Korean Government Ministry of Trade, Industry and Energy (MOTIE) (Human Resource Development","award":["P0008458"],"award-info":[{"award-number":["P0008458"]}]},{"DOI":"10.13039\/501100002538","name":"2022 Research Fund of Myongji University","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002538","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/access.2024.3351940","type":"journal-article","created":{"date-parts":[[2024,1,9]],"date-time":"2024-01-09T20:37:56Z","timestamp":1704832676000},"page":"6413-6422","source":"Crossref","is-referenced-by-count":13,"title":["Low Loss Hybrid-Plane PCB Structure for Improving Signal Quality in High-Speed Signal Transmission"],"prefix":"10.1109","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-9739-0392","authenticated-orcid":false,"given":"Jeonghyeon","family":"Choi","sequence":"first","affiliation":[{"name":"Department of Semiconductor Engineering, Myongji University, Yongin-si, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-3317-9859","authenticated-orcid":false,"given":"Youbean","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Semiconductor Engineering, Myongji University, Yongin-si, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ITAIC.2019.8785842"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICAICA.2019.8873480"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/6040.784495"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2001.915226"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2013.6724401"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2011.6100239"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TDEI.2009.4784562"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2006.874306"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JRPROC.1942.232015"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.1985.1133172"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.20.2475"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1038\/253717a0"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00106"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1038\/267673a0"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IMPACT.2013.6706695"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2013.6670430"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IMPACT.2007.4433639"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2012.6351671"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISAPE.2008.4735404"},{"key":"ref20","first-page":"413","volume-title":"Transmission Line Design Handbook","author":"Wadell","year":"1991"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/10380310\/10385078.pdf?arnumber=10385078","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,18]],"date-time":"2024-01-18T01:53:20Z","timestamp":1705542800000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10385078\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/access.2024.3351940","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]}}}