{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T00:12:16Z","timestamp":1780445536067,"version":"3.54.1"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","award":["2105164"],"award-info":[{"award-number":["2105164"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/access.2024.3363913","type":"journal-article","created":{"date-parts":[[2024,2,7]],"date-time":"2024-02-07T18:52:21Z","timestamp":1707331941000},"page":"23066-23080","source":"Crossref","is-referenced-by-count":5,"title":["Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC"],"prefix":"10.1109","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-8883-7790","authenticated-orcid":false,"given":"Madhava Sarma","family":"Vemuri","sequence":"first","affiliation":[{"name":"Department of Electrical and Computer Engineering, North Dakota State University, Fargo, ND, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9724-1585","authenticated-orcid":false,"given":"Umamaheswara Rao","family":"Tida","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, North Dakota State University, Fargo, ND, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2919606"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2637481"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2887053"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742994"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2338862"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3390\/mi10100637"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001435"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isvlsi.2016.94"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2011.10.025"},{"key":"ref10","volume-title":"Three-Dimensional Integrated Circuit Design","author":"Pavlidis","year":"2017"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS48704.2020.9184698"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/SOCC49529.2020.9524756"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED57927.2023.10129285"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593188"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2014.7028195"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2017.8009189"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2019.2942978"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2019.2925150"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2897589"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2009.2038165"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.23919\/DATE48585.2020.9116570"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS48704.2020.9184471"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2016.7804405"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2015.7159572"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/iitc-mam.2015.7325600"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2024210"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.877252"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2002.808159"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2012.2224105"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/6287639\/10380310\/10424972-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/10380310\/10424972.pdf?arnumber=10424972","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,14]],"date-time":"2024-03-14T01:17:23Z","timestamp":1710379043000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10424972\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/access.2024.3363913","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]}}}