{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,30]],"date-time":"2025-12-30T11:19:31Z","timestamp":1767093571084,"version":"3.41.2"},"reference-count":30,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"Polytechnique de Montreal","award":["BS123456"],"award-info":[{"award-number":["BS123456"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2024.3396373","type":"journal-article","created":{"date-parts":[[2024,5,2]],"date-time":"2024-05-02T13:28:23Z","timestamp":1714656503000},"page":"127758-127769","source":"Crossref","is-referenced-by-count":3,"title":["Thermal Analysis of System in Package Considering Boundary Conditions for Long-Term Reliability Studies"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1604-6674","authenticated-orcid":false,"given":"Djallel Eddine","family":"Touati","sequence":"first","affiliation":[{"name":"Department of Engineering and Computer Science, Université du Québec en Outaouais, Gatineau, QC, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Aziz","family":"Oukaira","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montréal, Montreal, QC, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2215-5375","authenticated-orcid":false,"given":"Ahmad","family":"Hassan","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montréal, Montreal, QC, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7476-7920","authenticated-orcid":false,"given":"Mohamed","family":"Ali","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montréal, Montreal, QC, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3404-9959","authenticated-orcid":false,"given":"Yvon","family":"Savaria","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, Polytechnique Montréal, Montreal, QC, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1781-3211","authenticated-orcid":false,"given":"Ahmed","family":"Lakhssassi","sequence":"additional","affiliation":[{"name":"Department of Engineering and Computer Science, Université du Québec en Outaouais, Gatineau, QC, Canada"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2008.5388564"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3152379"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2182067"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1115\/1.4047471"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS47672.2021.9531747"},{"key":"ref6","first-page":"664","article-title":"TSV-aware analytical placement for 3D IC designs","volume-title":"Proc. 48th ACM\/EDAC\/IEEE Design Autom. Conf. (DAC)","author":"Hsu"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2213820"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2014.08.012"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.2983248"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(02)00082-3"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2016.2574897"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2004.843186"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2016.2623420"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2014.2352933"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2357441"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS50681.2021.9462767"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12143154"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tc.2013.127"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2017.2695179"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2334321"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2666259"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2017.2656244"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2963265"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796518"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2697959"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2009.2020916"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2509506"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3064030"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICM56065.2022.10005514"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101770"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6287639\/10820123\/10517584.pdf?arnumber=10517584","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,26]],"date-time":"2025-07-26T07:41:05Z","timestamp":1753515665000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10517584\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":30,"URL":"https:\/\/doi.org\/10.1109\/access.2024.3396373","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2025]]}}}