{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,1]],"date-time":"2026-08-01T16:50:37Z","timestamp":1785603037736,"version":"3.56.0"},"reference-count":60,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2024]]},"DOI":"10.1109\/access.2024.3450869","type":"journal-article","created":{"date-parts":[[2024,8,28]],"date-time":"2024-08-28T19:00:23Z","timestamp":1724871623000},"page":"122078-122100","source":"Crossref","is-referenced-by-count":16,"title":["Digital Twin-Based Optimization of Operational Parameters for Cluster Tools in Semiconductor Manufacturing"],"prefix":"10.1109","volume":"12","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-3056-5547","authenticated-orcid":false,"given":"Joonick","family":"Hwang","sequence":"first","affiliation":[{"name":"Department of Semiconductor and Display Engineering, Sungkyunkwan University, Suwon-si, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sang do","family":"Noh","sequence":"additional","affiliation":[{"name":"Department of Industrial Engineering, Sungkyunkwan University, Suwon-si, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MITP.2021.3105248"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.ifacol.2022.09.439"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4614-4472-5_2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1002\/ajim.4700110209"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.5772\/8561"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4613-0885-0_8"},{"key":"ref7","first-page":"1","article-title":"Manufacturing execution system (MES) for semiconductor manufacturing","volume-title":"Proc. IEEE Int. Conf. Syst., Man Cybern.","volume":"4","author":"Chung"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3390\/pr6020016"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/WSC57314.2022.10015417"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/66.4384"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/math9091029"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/KEM.814.196"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/WSC.2011.6147895"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1080\/002075499190473"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/WSC.1994.717467"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2427273"},{"issue":"4","key":"ref17","first-page":"417","article-title":"A scheduling method with wafer transfer delay in the cluster tool process","volume":"22","author":"Hur","year":"2011","journal-title":"J. Korean Prod. Oper. Manage. Soc."},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2003.815203"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.3390\/app12157519"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-38756-7_4"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1080\/00207543.2019.1566661"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.15269\/JKSOEH.2015.25.2.202"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.1999.804799"},{"issue":"1","key":"ref24","first-page":"29","article-title":"The cluster controller","volume":"13","author":"Lee","year":"1998","journal-title":"Electron. Telecommun. Trends"},{"key":"ref25","first-page":"5","article-title":"Semiconductor manufacturing and cluster tools","volume-title":"Modeling and Optimization of Cluster Tools in Semiconductor Manufacturing","author":"D\u00fcmmler","year":"2004"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.831524"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1080\/00207540600792531"},{"key":"ref28","first-page":"107","article-title":"Scheduling and determination of feasible process times for CVD cluster tools with a dual end effector","volume-title":"Proc. Korean Oper. Res. Manage. Sci. Soc. Conf. Paper","volume":"1","author":"Lee"},{"issue":"5","key":"ref29","first-page":"31","article-title":"Study on measurement of wafer processing throughput and sequence simulation of SWP (single wafer process) cleaning equipment","volume":"42","author":"Sun","year":"2005","journal-title":"Inst. Electron. Eng. Korea Comput. Inform."},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/CASE48305.2020.9216790"},{"key":"ref31","first-page":"232","article-title":"Equipment engineering","volume-title":"MES Technology for Smart Manufacturing","author":"Chung","year":"2022"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1007\/s10696-012-9161-4"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2021.3075255"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2015.2445320"},{"issue":"2","key":"ref35","first-page":"167","article-title":"Design and implementation of a hybrid equipment data acquisition system (HEDAS) for equipment engineering System(EES) framework","volume":"17","author":"Kim","year":"2012","journal-title":"J. Korea Soc. Comput. Inf."},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC54647.2022.9792476"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.ifacol.2022.10.091"},{"key":"ref38","first-page":"1","article-title":"Digital twin: Manufacturing excellence through virtual factory replication","volume":"1","author":"Grieves","year":"2014","journal-title":"White Paper"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TII.2018.2873186"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1093\/jcde\/qwab067"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2019.101837"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1186\/s40323-020-00147-4"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2970143"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-61045-6_8"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/WSC57314.2022.10015307"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1007\/s11518-023-5564-x"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/HORA52670.2021.9461187"},{"key":"ref48","first-page":"139","article-title":"Wafer manipulating robots-design, programming and simulation","volume-title":"Sensors, Signals, Visualization, Imaging, Simulation and Materials","author":"Nicolescu","year":"2009"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.18178\/ijeetc.10.2.105-114"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1109\/ISSM.2006.4493037"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1145\/382192.383004"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/MS.1998.714621"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1002\/swf.45"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1201\/9781420013641.ch4"},{"key":"ref55","first-page":"81","article-title":"Finite automata","volume-title":"An Introduction to Formal Languages and Automata","author":"Linz","year":"2016"},{"issue":"1","key":"ref56","first-page":"157","article-title":"Application of data mining for improving and predicting yield in wafer fabrication system","volume":"9","author":"Baek","year":"2003","journal-title":"J. Korea Intell. Inform. Syst. Soc."},{"key":"ref57","doi-asserted-by":"publisher","DOI":"10.1002\/0470018860.s00015"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/TSMCC.2011.2161669"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1116\/1.4822034"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.5302\/J.ICROS.2015.15.0095"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10380310\/10654274.pdf?arnumber=10654274","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T04:59:02Z","timestamp":1726030742000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10654274\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"references-count":60,"URL":"https:\/\/doi.org\/10.1109\/access.2024.3450869","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]}}}