{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,25]],"date-time":"2026-02-25T18:02:19Z","timestamp":1772042539375,"version":"3.50.1"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2024.3525123","type":"journal-article","created":{"date-parts":[[2025,1,2]],"date-time":"2025-01-02T19:32:30Z","timestamp":1735846350000},"page":"3251-3260","source":"Crossref","is-referenced-by-count":1,"title":["Research on BHAST Test Method for Plastic Encapsulated Microcircuit"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-9740-9559","authenticated-orcid":false,"given":"Yuege","family":"Zhou","sequence":"first","affiliation":[{"name":"Beijing Key Laboratory of Environment and Reliability Test Technology for Aerospace Mechanical and Electrical Products, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1460-3614","authenticated-orcid":false,"given":"Bo","family":"Wan","sequence":"additional","affiliation":[{"name":"School of Reliability and Systems Engineering, Beihang University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-3170-5517","authenticated-orcid":false,"given":"Qingsheng","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Reliability and Systems Engineering, Beihang University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8816-0206","authenticated-orcid":false,"given":"Jingyang","family":"Zhong","sequence":"additional","affiliation":[{"name":"School of Reliability and Systems Engineering, Beihang University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0942-1323","authenticated-orcid":false,"given":"Shupeng","family":"Li","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Environment and Reliability Test Technology for Aerospace Mechanical and Electrical Products, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tengfei","family":"Ma","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Environment and Reliability Test Technology for Aerospace Mechanical and Electrical Products, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Guo","sequence":"additional","affiliation":[{"name":"Beijing Key Laboratory of Environment and Reliability Test Technology for Aerospace Mechanical and Electrical Products, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mssp.2024.108560"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.3390\/electronics8030279"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-011-0357-2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1115\/1.4062828"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.03.008"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-017-8464-3"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1115\/1.4064355"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2020.113647"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2021.3109347"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2023.3246498"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2023.115211"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2022.114891"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2014.02.027"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.5781\/JWJ.2021.39.4.1"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2022.114630"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.33162\/JAR.2021.3.21.1.26"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.2494\/photopolymer.28.85"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.6117\/kmeps.2015.22.1.043"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/s11668-022-01528-0"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2023.115104"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-014-2234-2"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.09.027"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.3390\/cmd2030023"},{"key":"ref24","volume-title":"JEDEC Solid State Technology Association. JESD22-A110E: Highly Accelerated Temperature and Humidity Stress Test (HAST). JEDEC Solid State Technology Association","year":"2021"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2016.07.105"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/cstic.2018.8369175"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.4028\/www.scientific.net\/AMR.750-752.1879"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/ab1891"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/10820332.pdf?arnumber=10820332","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,9]],"date-time":"2025-01-09T06:20:56Z","timestamp":1736403656000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10820332\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/access.2024.3525123","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}