{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,24]],"date-time":"2025-12-24T12:21:29Z","timestamp":1766578889718,"version":"3.37.3"},"reference-count":19,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2025.3533212","type":"journal-article","created":{"date-parts":[[2025,1,23]],"date-time":"2025-01-23T18:46:21Z","timestamp":1737657981000},"page":"26676-26683","source":"Crossref","is-referenced-by-count":1,"title":["Design and Process Analysis of a Split-Gate Trench Power MOSFET With Bottom-Trench High-<i>k<\/i> Pillar Superjunction for Enhanced Performance"],"prefix":"10.1109","volume":"13","author":[{"given":"Yunteng","family":"Jiang","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-9336-5824","authenticated-orcid":false,"given":"Zhentao","family":"Xiao","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-0723-781X","authenticated-orcid":false,"given":"Zonghao","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"given":"Junchen","family":"Zhang","sequence":"additional","affiliation":[{"name":"Nanyang Technological University, Jurong West, Singapore"}]},{"given":"Chenxing","family":"Wang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"given":"Wenjun","family":"Li","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3000-741X","authenticated-orcid":false,"given":"Haimeng","family":"Huang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3825-1484","authenticated-orcid":false,"given":"Aynul","family":"Islam","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]},{"given":"Hongqiang","family":"Yang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China, Chengdu, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2653239"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-47314-7"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/SCED.2009.4800478"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2658344"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/16.842974"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.spmi.2018.10.016"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2012.2204890"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.2989418"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON58565.2023.10396386"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1049\/mnl.2018.5501"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/1674-4926\/37\/6\/064014"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1049\/pel2.12700"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2024.3467211"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.2977766"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1088\/1674-4926\/44\/5\/052801"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2007.910573"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2019.2928091"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISPSD.1995.515055"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.3390\/mi13060843"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/10850909.pdf?arnumber=10850909","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,20]],"date-time":"2025-02-20T20:50:15Z","timestamp":1740084615000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10850909\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/access.2025.3533212","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2025]]}}}