{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,26]],"date-time":"2025-06-26T04:02:34Z","timestamp":1750910554090,"version":"3.41.0"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2025.3576161","type":"journal-article","created":{"date-parts":[[2025,6,2]],"date-time":"2025-06-02T18:02:32Z","timestamp":1748887352000},"page":"105141-105150","source":"Crossref","is-referenced-by-count":0,"title":["ML-Driven Transistor Self-Heating Analysis From TCAD to Large IP Circuits"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7902-9353","authenticated-orcid":false,"given":"Simon","family":"Thomann","sequence":"first","affiliation":[{"name":"Chair of AI Processor Design, TUM School of Computation, Information and Technology and Munich Institute of Robotics and Machine Intelligence, Technical University of Munich, Munich, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-8561-4288","authenticated-orcid":false,"given":"Nico","family":"Mayr","sequence":"additional","affiliation":[{"name":"Chair of AI Processor Design, TUM School of Computation, Information and Technology and Munich Institute of Robotics and Machine Intelligence, Technical University of Munich, Munich, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7841-1975","authenticated-orcid":false,"given":"Albi","family":"Mema","sequence":"additional","affiliation":[{"name":"Chair of AI Processor Design, TUM School of Computation, Information and Technology and Munich Institute of Robotics and Machine Intelligence, Technical University of Munich, Munich, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5649-3102","authenticated-orcid":false,"given":"Hussam","family":"Amrouch","sequence":"additional","affiliation":[{"name":"Chair of AI Processor Design, TUM School of Computation, Information and Technology and Munich Institute of Robotics and Machine Intelligence, Technical University of Munich, Munich, Germany"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2016.2568261"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6861186"},{"key":"ref3","first-page":"11.6.1","article-title":"Self-heating on bulk FinFET from 14 nm down to 7 nm node","author":"Jang","year":"2015","journal-title":"IEDM Tech. Dig."},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2941445"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2004.1419081"},{"volume-title":"TSMC N2 NANOSHEET","year":"2024","key":"ref6"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2009.2016764"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/43.828548"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1115\/1.2957318"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.1567461"},{"issue":"7","key":"ref11","doi-asserted-by":"crossref","first-page":"845","DOI":"10.1016\/0026-2714(96)00022-4","article-title":"A review of hot-carrier degradation mechanisms in MOSFETs","volume":"36","author":"Acovic","year":"1996","journal-title":"Microelectron. Rel."},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.1611649"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/24.387379"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1149\/11101.0149ecst"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48228.2024.10529429"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/IIRW.2012.6468962"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1984.190650"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879794"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9128342"},{"key":"ref20","doi-asserted-by":"crossref","DOI":"10.1016\/j.sse.2022.108586","article-title":"CARAT\u2014A reliability analysis framework for BTI-HCD aging in circuits","volume":"201","author":"Gholve","year":"2023","journal-title":"Solid-State Electron."},{"volume-title":"Sentaurus TCAD U-2022.12-SP1","year":"2025","key":"ref21"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/vlsitechnology18217.2020.9265034"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/6144.974944"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.3048918"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3251296"},{"key":"ref26","first-page":"21415","article-title":"SyncTREE: Fast timing analysis for integrated circuit design through a physics-informed tree-based graph neural network","volume-title":"Proc. Adv. Neural Inf. Process. Syst.","volume":"36","author":"Hu"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3069664"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3147587"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3201431"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3244764"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2023.3336305"},{"volume-title":"A Heat Transfer Textbook","year":"2024","author":"Lienhard","key":"ref32"},{"key":"ref33","doi-asserted-by":"crossref","first-page":"219","DOI":"10.1016\/j.sse.2015.08.022","article-title":"Comparison of self-heating and its effect on analogue performance in 28 nm bulk and FDSOI","volume":"115","author":"Makovejev","year":"2016","journal-title":"Solid-State Electron."},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6860642"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2010.2090348"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/11021597.pdf?arnumber=11021597","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,25]],"date-time":"2025-06-25T05:24:20Z","timestamp":1750829060000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11021597\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":35,"URL":"https:\/\/doi.org\/10.1109\/access.2025.3576161","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2025]]}}}