{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,19]],"date-time":"2026-02-19T16:35:57Z","timestamp":1771518957810,"version":"3.50.1"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"Challengeable Future Defense Technology Research and Development Program through the Agency For Defense Development"},{"name":"Defense Acquisition Program Administration (DAPA), in 2024","award":["UD230001TD"],"award-info":[{"award-number":["UD230001TD"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2025.3577256","type":"journal-article","created":{"date-parts":[[2025,6,6]],"date-time":"2025-06-06T17:43:06Z","timestamp":1749231786000},"page":"107736-107744","source":"Crossref","is-referenced-by-count":1,"title":["Antenna-in-Package Using IC-Embedded Metal Fan-Out Wafer-Level Package for D-Band Applications"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-7336-5601","authenticated-orcid":false,"given":"Ju-Yong","family":"Lee","sequence":"first","affiliation":[{"name":"Package Research Center, Korea Electronics Technology Institute, Seongnam, Gyeonggi-do, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2000-6026","authenticated-orcid":false,"given":"Jein","family":"Yu","sequence":"additional","affiliation":[{"name":"Package Research Center, Korea Electronics Technology Institute, Seongnam, Gyeonggi-do, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wansik","family":"Kim","sequence":"additional","affiliation":[{"name":"Satellite System, LIG Nex1, Yongin, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8045-3282","authenticated-orcid":false,"given":"Jong-Min","family":"Yook","sequence":"additional","affiliation":[{"name":"Package Research Center, Korea Electronics Technology Institute, Seongnam, Gyeonggi-do, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2018.8428981"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3329512"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/JCC.ja.2022-0406"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCCN.2023.3334206"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.3390\/s21061951"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2977922"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2025.3540716"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2023.3240127"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3232948"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3344093"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/OJAP.2021.3089052"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2023.3251725"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2019.2939392"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/GSMM.2016.7500312"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2011.5973141"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2365460"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2013.2296318"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/PIMRC.2013.6666358"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ICUWB.2014.6958972"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2019.2940110"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/APUSNCURSINRSM.2019.8889358"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2023.3237162"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/IMWS3.2011.6061881"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/EuMC.2016.7824632"},{"key":"ref25","first-page":"1318","article-title":"D-band grid-array antenna integrated in the lid of a surface-mountable chip-package","volume-title":"Proc. 7th Eur. Conf. Antennas Propag. (EuCAP)","author":"Beer"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.23919\/EuMC.2018.8541732"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.23919\/EuMC.2019.8910866"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/RWS45077.2020.9049978"},{"key":"ref29","first-page":"96","article-title":"A 122 GHz ISM-band FMCW radar transceiver","volume-title":"Proc. German Microw. Conf. (GeMiC)","author":"Lammert"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2016.2519522"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2022.3161972"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1017\/S175907871900031X"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/11027070.pdf?arnumber=11027070","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,28]],"date-time":"2025-06-28T06:29:09Z","timestamp":1751092149000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11027070\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":32,"URL":"https:\/\/doi.org\/10.1109\/access.2025.3577256","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}