{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T15:59:34Z","timestamp":1781798374046,"version":"3.54.5"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by-nc-nd\/4.0\/"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001321","name":"National Research Foundation","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100001321","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Korean Government [Ministry of Science and Information and Communication Technology (MSIT)]","award":["RS-2024-00423772"],"award-info":[{"award-number":["RS-2024-00423772"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2025.3580727","type":"journal-article","created":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T13:40:10Z","timestamp":1750254010000},"page":"107926-107935","source":"Crossref","is-referenced-by-count":4,"title":["Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5305-3710","authenticated-orcid":false,"given":"Jeong-Hyeon","family":"Park","sequence":"first","affiliation":[{"name":"Department of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0886-3903","authenticated-orcid":false,"given":"Jaechoon","family":"Kim","sequence":"additional","affiliation":[{"name":"Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sukwon","family":"Jang","sequence":"additional","affiliation":[{"name":"Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sungho","family":"Mun","sequence":"additional","affiliation":[{"name":"Division of Semiconductor Research and Development Center, Samsung Electronics, Yongin, Gyeonggi-do, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1270-7954","authenticated-orcid":false,"given":"Eun-Ho","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Sungkyunkwan University, Suwon, Gyeonggi-do, Republic of Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IMW.2017.7939084"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00268"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51529.2024.00169"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074080"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1088\/0034-4885\/62\/3\/001"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3174882"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2024.3397616"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/access.2024.3396373"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3297222"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.2980039"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.apm.2024.02.034"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.199"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51909.2023.00041"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/BF02584103"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1017\/cbo9780511709333"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ESIME.2010.5464514"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/6144.926382"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijplas.2024.104073"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2024.3380463"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/tte.2025.3549447"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ITherm45881.2020.9190418"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1007\/s11666-012-9828-0"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymdegradstab.2014.03.043"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ITherm51669.2021.9503228"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/11039833.pdf?arnumber=11039833","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,18]],"date-time":"2025-07-18T04:48:13Z","timestamp":1752814093000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11039833\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/access.2025.3580727","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}