{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T17:12:29Z","timestamp":1754154749155,"version":"3.41.2"},"reference-count":62,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"SK Hynix Inc"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2025.3585957","type":"journal-article","created":{"date-parts":[[2025,7,4]],"date-time":"2025-07-04T13:51:59Z","timestamp":1751637119000},"page":"126718-126735","source":"Crossref","is-referenced-by-count":0,"title":["Scalable and Fast Electrical Modeling Method for Bonding-Wire Memory Packages"],"prefix":"10.1109","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9846-7634","authenticated-orcid":false,"given":"Dongryul","family":"Park","sequence":"first","affiliation":[{"name":"CCS Graduate School of Mobility, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4829-2551","authenticated-orcid":false,"given":"Seonghi","family":"Lee","sequence":"additional","affiliation":[{"name":"CCS Graduate School of Mobility, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7967-9436","authenticated-orcid":false,"given":"Seunghun","family":"Ryu","sequence":"additional","affiliation":[{"name":"CCS Graduate School of Mobility, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3213-2660","authenticated-orcid":false,"given":"Hyunwoo","family":"Kim","sequence":"additional","affiliation":[{"name":"CCS Graduate School of Mobility, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Duksoo","family":"Kim","sequence":"additional","affiliation":[{"name":"SK Hynix Inc., Icheon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hyunsik","family":"Kim","sequence":"additional","affiliation":[{"name":"SK Hynix Inc., Icheon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0379-6521","authenticated-orcid":false,"given":"Jongwook","family":"Kim","sequence":"additional","affiliation":[{"name":"SK Hynix Inc., Icheon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0771-7050","authenticated-orcid":false,"given":"Seungyoung","family":"Ahn","sequence":"additional","affiliation":[{"name":"CCS Graduate School of Mobility, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1109\/MSSC.2019.2910617"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/ICEPT.2016.7583363"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/ECTC.2011.5898709"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/ECTC.2017.134"},{"key":"ref5","first-page":"131","volume-title":"Advanced Wire Bonding Technology: Materials, Methods, and Testing","author":"Charles","year":"2017"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1016\/j.mee.2014.10.019"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/TADVP.2004.831870"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/EMCSIPI50001.2023.10241728"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/ISEMC.2019.8825217"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/EPTC47984.2019.9026595"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/TCPMT.2024.3381342"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/TEMC.2023.3343700"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1109\/TEMC.2023.3318082"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/TCPMT.2023.3317295"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/TCPMT.2010.2101890"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/TCPMT.2019.2895083"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/TCPMT.2013.2276050"},{"doi-asserted-by":"publisher","key":"ref18","DOI":"10.1109\/TMTT.2012.2217983"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/TII.2017.2737525"},{"issue":"3","key":"ref20","doi-asserted-by":"crossref","first-page":"365","DOI":"10.3390\/electronics8030365","article-title":"Analysis and experimental test of electrical characteristics on bonding wire","volume":"8","author":"Tian","year":"2019","journal-title":"Electronics"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/ARFTG52261.2021.9640137"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/ECTC.2008.4550131"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1109\/9780470547212"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1002\/9781118646700"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1109\/22.641784"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1109\/TMTT.2008.2002237"},{"doi-asserted-by":"publisher","key":"ref27","DOI":"10.1109\/TEMC.2015.2440299"},{"doi-asserted-by":"publisher","key":"ref28","DOI":"10.1109\/TEMC.2017.2726560"},{"doi-asserted-by":"publisher","key":"ref29","DOI":"10.1109\/TCPMT.2022.3143110"},{"doi-asserted-by":"publisher","key":"ref30","DOI":"10.1109\/TCPMT.2024.3487577"},{"volume-title":"JEDEC,. EIA\/JEDEC","year":"1997","key":"ref31"},{"doi-asserted-by":"publisher","key":"ref32","DOI":"10.1002\/9780470561232"},{"doi-asserted-by":"publisher","key":"ref33","DOI":"10.23919\/EMCTokyo.2019.8893728"},{"volume-title":"Field and Wave Electromagnetics","year":"1989","author":"Cheng","key":"ref34"},{"doi-asserted-by":"publisher","key":"ref35","DOI":"10.1109\/SSST.1990.138213"},{"volume-title":"CA, \u2019HSPICE: The Gold Standard for Accurate Circuit Simulation\u2019","year":"2009","key":"ref36"},{"doi-asserted-by":"publisher","key":"ref37","DOI":"10.1109\/81.486433"},{"doi-asserted-by":"publisher","key":"ref38","DOI":"10.1109\/22.297805"},{"volume-title":"Signal Integrity: Simplified","year":"2004","author":"Bogatin","key":"ref39"},{"doi-asserted-by":"publisher","key":"ref40","DOI":"10.1002\/9780470423899"},{"doi-asserted-by":"publisher","key":"ref41","DOI":"10.1109\/TCPMT.2020.3045877"},{"doi-asserted-by":"publisher","key":"ref42","DOI":"10.1109\/LMWC.2018.2812639"},{"volume-title":"Proc. DesignCon","author":"Kim","article-title":"Analysis on power via induced quasi-quarter-wavelength resonance for crosstalk reduction","key":"ref43"},{"doi-asserted-by":"publisher","key":"ref44","DOI":"10.1038\/s41586-020-2649-2"},{"key":"ref45","volume":"23","author":"Greub","year":"2012","journal-title":"Linear Algebra"},{"doi-asserted-by":"publisher","key":"ref46","DOI":"10.1109\/MMM.2021.3117139"},{"doi-asserted-by":"publisher","key":"ref47","DOI":"10.1109\/MWSYM.1981.1129978"},{"volume-title":"Microwave Engineering: Theory and Techniques","year":"2021","author":"Pozar","key":"ref48"},{"doi-asserted-by":"publisher","key":"ref49","DOI":"10.5555\/3291168.3291210"},{"doi-asserted-by":"publisher","key":"ref50","DOI":"10.1109\/IMS40175.2024.10600341"},{"doi-asserted-by":"publisher","key":"ref51","DOI":"10.1109\/TEMC.2018.2825656"},{"doi-asserted-by":"publisher","key":"ref52","DOI":"10.1109\/EPEPS61853.2024.10754560"},{"volume-title":"JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel High-Performance Computing and AI","year":"2024","key":"ref53"},{"issue":"3","key":"ref54","doi-asserted-by":"crossref","first-page":"632","DOI":"10.3390\/electronics12030632","article-title":"A wire-bonded patch antenna for millimeter wave applications","volume":"12","author":"Bogdan","year":"2023","journal-title":"Electronics"},{"doi-asserted-by":"publisher","key":"ref55","DOI":"10.1109\/MWSYM.2009.5166008"},{"doi-asserted-by":"publisher","key":"ref56","DOI":"10.4071\/isom-2010-THA4-Paper2"},{"doi-asserted-by":"publisher","key":"ref57","DOI":"10.1109\/TCAD.2012.2228740"},{"volume-title":"CST Microwave Studio","key":"ref58"},{"volume-title":"XFDTD 3D Electromagnetic Simulation Software","key":"ref59"},{"doi-asserted-by":"publisher","key":"ref60","DOI":"10.1109\/TMTT.2016.2518164"},{"key":"ref61","doi-asserted-by":"crossref","DOI":"10.1016\/j.mejo.2023.106027","article-title":"Analytical equivalent circuit modeling and analysis of complex BGA for 3D silicon-interposer packaging","volume":"143","author":"Tang","year":"2024","journal-title":"Microelectron. J."},{"doi-asserted-by":"publisher","key":"ref62","DOI":"10.1109\/TCPMT.2023.3336631"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/11071706.pdf?arnumber=11071706","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,24]],"date-time":"2025-07-24T17:57:55Z","timestamp":1753379875000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11071706\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":62,"URL":"https:\/\/doi.org\/10.1109\/access.2025.3585957","relation":{},"ISSN":["2169-3536"],"issn-type":[{"type":"electronic","value":"2169-3536"}],"subject":[],"published":{"date-parts":[[2025]]}}}