{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,14]],"date-time":"2026-03-14T18:07:20Z","timestamp":1773511640233,"version":"3.50.1"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"DOI":"10.13039\/100000882","name":"Brain Korea 21 (BK21) FOUR project","doi-asserted-by":"publisher","award":["4199990113966"],"award-info":[{"award-number":["4199990113966"]}],"id":[{"id":"10.13039\/100000882","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Basic Science Research Program","award":["RS-2018-NR031059, 10%"],"award-info":[{"award-number":["RS-2018-NR031059, 10%"]}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Ministry of Education"},{"name":"Institute of Information and communications Technology Planning and Evaluation"},{"name":"Korean Government","award":["No. 2022-0-01170, 30%"],"award-info":[{"award-number":["No. 2022-0-01170, 30%"]}]},{"name":"Korean Government","award":["No. RS-2023-00228970, 30%"],"award-info":[{"award-number":["No. RS-2023-00228970, 30%"]}]},{"name":"Korean Government","award":["No. RS-2025-02218227, 30%"],"award-info":[{"award-number":["No. RS-2025-02218227, 30%"]}]},{"name":"IC Design Education Center (IDEC), Korea"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/access.2025.3586940","type":"journal-article","created":{"date-parts":[[2025,7,8]],"date-time":"2025-07-08T13:39:17Z","timestamp":1751981957000},"page":"120772-120784","source":"Crossref","is-referenced-by-count":3,"title":["Flexible Edge-AI Software Execution Architecture Based on Cloud-Connected Incremental Learning"],"prefix":"10.1109","volume":"13","author":[{"given":"Myeongjin","family":"Kang","sequence":"first","affiliation":[{"name":"School of Electronic and Electrical Engineering, Kyungpook National University, Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5560-873X","authenticated-orcid":false,"given":"Daejin","family":"Park","sequence":"additional","affiliation":[{"name":"School of Electronics Engineering, Kyungpook National University, Daegu, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/INCoS.2016.106"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CLOUD49709.2020.00042"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICSESS47205.2019.9040830"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/EDGE50951.2020.00015"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/SmartIoT58732.2023.00024"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EDGE60047.2023.00056"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/5GWF52925.2021.00087"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3109875"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICMCCE.2018.00041"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCC.2022.3201544"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCC.2022.3175725"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TELFOR52709.2021.9653383"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LES.2023.3298731"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/OJCOMS.2020.2994737"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3464419"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/CCC50068.2020.9188668"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/3510454.352864"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.simpat.2016.08.010"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2019.2946140"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TNNLS.2022.3190451"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-SoC57769.2023.10321845"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2022.3231239"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/WSC48552.2020.9383986"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12244901"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2021.3088910"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/5.726791"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/10820123\/11072668.pdf?arnumber=11072668","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,18]],"date-time":"2025-07-18T17:46:41Z","timestamp":1752860801000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11072668\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":26,"URL":"https:\/\/doi.org\/10.1109\/access.2025.3586940","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]}}}