{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T21:43:36Z","timestamp":1770932616108,"version":"3.50.1"},"reference-count":14,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"Ministry of Trade, Industry and Energy (MOTIE), Republic of Korea, titled \u201cEstablishment of Security Evaluation Infrastructure for Autonomous Vehicle System-Semiconductors\u201d","award":["RS-2025-14342991"],"award-info":[{"award-number":["RS-2025-14342991"]}]},{"name":"\u201cIndustrial Innovation Foundation for Functional Safety and Reliability of Automotive Semiconductor\u201d","award":["P0021591"],"award-info":[{"award-number":["P0021591"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/access.2026.3660730","type":"journal-article","created":{"date-parts":[[2026,2,3]],"date-time":"2026-02-03T20:56:06Z","timestamp":1770152166000},"page":"20077-20083","source":"Crossref","is-referenced-by-count":0,"title":["Analytical Extraction of Thermal Resistance in Power Semiconductors Using Structural Function Derivatives and Series Resistance Modeling"],"prefix":"10.1109","volume":"14","author":[{"given":"Kwangsun","family":"Lee","sequence":"first","affiliation":[{"name":"Reliability R&D Division, Korea Automotive Technology Institute, Cheonan-si, Republic of Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3031-0715","authenticated-orcid":false,"given":"Hojoon","family":"Lee","sequence":"additional","affiliation":[{"name":"Reliability R&D Division, Korea Automotive Technology Institute, Cheonan-si, Republic of Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-8734-0134","authenticated-orcid":false,"given":"Jihyun","family":"Lee","sequence":"additional","affiliation":[{"name":"Reliability R&D Division, Korea Automotive Technology Institute, Cheonan-si, Republic of Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-0236-6698","authenticated-orcid":false,"given":"Hyunchul","family":"Sagong","sequence":"additional","affiliation":[{"name":"Reliability R&D Division, Korea Automotive Technology Institute, Cheonan-si, Republic of Korea"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"JEDEC Solid State Technology Association, Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices With Heat Flow Through a Single Path (JESD51-14)","year":"2010"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2005.859768"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2008.4509389"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.03.017"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3042495"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.3390\/en13030557"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2718245"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2017.7992501"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2004.10.030"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2023.122104"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2008.4544297"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2019.06.045"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2015.12.010"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2002.808003"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/11323511\/11370807.pdf?arnumber=11370807","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,12]],"date-time":"2026-02-12T21:01:14Z","timestamp":1770930074000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11370807\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/access.2026.3660730","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}