{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,30]],"date-time":"2026-03-30T21:04:36Z","timestamp":1774904676371,"version":"3.50.1"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/access.2026.3676686","type":"journal-article","created":{"date-parts":[[2026,3,23]],"date-time":"2026-03-23T20:09:20Z","timestamp":1774296560000},"page":"45271-45279","source":"Crossref","is-referenced-by-count":0,"title":["Performance Analysis of L-Shaped Cladding Layer-Based Dopingless TFET Including Interface Trap Charges and Temperatures"],"prefix":"10.1109","volume":"14","author":[{"given":"S.","family":"Shabareeshan","sequence":"first","affiliation":[{"name":"School of Electronics Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Srinidhi","family":"Balakrishnan","sequence":"additional","affiliation":[{"name":"School of Electronics Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6711-5716","authenticated-orcid":false,"given":"Shanidul","family":"Hoque","sequence":"additional","affiliation":[{"name":"School of Electronics Engineering, Vellore Institute of Technology, Vellore, Tamil Nadu, India"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3108-6081","authenticated-orcid":false,"given":"Rajesh","family":"Saha","sequence":"additional","affiliation":[{"name":"Department of Electronics and Communication Engineering, National Institute of Technology Silchar, Silchar, Assam, India"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/5.915374"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2003.812504"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2005.10.049"},{"key":"ref4","article-title":"Impact of temperature on the performance of tunnel field effect transistor","volume-title":"Proc. CEUR Workshop","volume":"3058","author":"Walia"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/DRC.2008.4800741"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-023-38651-3"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.spmi.2016.09.050"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s12633-021-01416-6"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.mseb.2023.116491"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-025-13011-5"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/SNW.2010.5562556"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1016\/j.cap.2012.03.029"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2024.106201"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3229257"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-025-88281-0"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1186\/s11671-020-03429-3"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.micrna.2023.207741"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2052167"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2898403"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2021.105348"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/s12633-021-01421-9"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2022.105629"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-025-02428-7"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3156895"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/s10825-022-01902-z"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2025.115840"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2022.105581"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2022.114780"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1002\/jnm.2967"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2024.106412"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1007\/s00339-021-04541-6"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2020.2984669"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-021-06823-4"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1007\/s10854-022-07860-3"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/11323511\/11450363.pdf?arnumber=11450363","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,30]],"date-time":"2026-03-30T20:07:46Z","timestamp":1774901266000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11450363\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":34,"URL":"https:\/\/doi.org\/10.1109\/access.2026.3676686","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}