{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,7]],"date-time":"2026-08-07T16:23:28Z","timestamp":1786119808956,"version":"build-2736575974"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","license":[{"start":{"date-parts":[[2026,1,1]],"date-time":"2026-01-01T00:00:00Z","timestamp":1767225600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"funder":[{"name":"Technology Innovation Program","award":["RS-2025-25463078"],"award-info":[{"award-number":["RS-2025-25463078"]}]},{"name":"Ministry of Trade, Industry and Resources"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Access"],"published-print":{"date-parts":[[2026]]},"DOI":"10.1109\/access.2026.3717243","type":"journal-article","created":{"date-parts":[[2026,7,27]],"date-time":"2026-07-27T19:06:47Z","timestamp":1785179207000},"page":"116613-116620","source":"Crossref","is-referenced-by-count":0,"title":["IBIS-Based Chiplet Design Methodology for Accurate Signal Integrity"],"prefix":"10.1109","volume":"14","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-6029-7326","authenticated-orcid":false,"given":"Jimin","family":"Song","sequence":"first","affiliation":[{"name":"Kyung Hee University","place":["Yongin-si, Gyeonggi-do, Republic of Korea"],"department":["Department of Semiconductor Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5446-1799","authenticated-orcid":false,"given":"Junyong","family":"Park","sequence":"additional","affiliation":[{"name":"Kyung Hee University","place":["Yongin-si, Gyeonggi-do, Republic of Korea"],"department":["Department of Semiconductor Engineering"]}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/3489517.3530428"},{"key":"ref2","volume-title":"Universal Chiplet Interconnect Express (UCIe) Specification Revision 2.0, UCIe Consortium","year":"2024"},{"key":"ref3","volume-title":"Bunch of Wires (BoW) Interface Specification Revision 2.1, Open Compute Project (OCP)","year":"2023"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2010.2045381"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2010.2048755"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/temc.2016.2630080"},{"key":"ref7","volume-title":"IBIS Modeling Cookbook for IBIS Version 4.0","year":"2005"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2022.3207195"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2017.2674686"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/memc.2014.6798802"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tcapt.2008.2001163"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/apemc.2008.4559922"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/aspdac.2015.7059032"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2015.2450723"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tadvp.2004.831856"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2026.3702739"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ojsscs.2024.3502315"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/6040.928747"}],"container-title":["IEEE Access"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/6287639\/11323511\/11625765.pdf?arnumber=11625765","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,8,6]],"date-time":"2026-08-06T19:10:55Z","timestamp":1786043455000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11625765\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/access.2026.3717243","relation":{},"ISSN":["2169-3536"],"issn-type":[{"value":"2169-3536","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026]]}}}