{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,13]],"date-time":"2025-05-13T23:04:17Z","timestamp":1747177457611},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,12]]},"DOI":"10.1109\/apccas.2010.5774962","type":"proceedings-article","created":{"date-parts":[[2011,5,27]],"date-time":"2011-05-27T17:30:45Z","timestamp":1306517445000},"page":"1087-1090","source":"Crossref","is-referenced-by-count":1,"title":["Thermal-aware router-sharing architecture for 3D Network-on-Chip designs"],"prefix":"10.1109","author":[{"given":"Yong-Ruei","family":"Huang","sequence":"first","affiliation":[]},{"given":"Jia-Hong","family":"Pan","sequence":"additional","affiliation":[]},{"given":"Yi-Chang","family":"Lu","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"209","article-title":"Thermal via planning for 3D ICs","author":"cong","year":"2005","journal-title":"IEEE\/ACM International Conference on Computer-Aided Design"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/NANONET.2006.346233"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/NOCS.2010.32"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687447"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687524"},{"journal-title":"Noxim Network-on-chip simulator","year":"0","author":"fazzino","key":"ref11"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"130","DOI":"10.1145\/1150019.1136497","article-title":"Design and management of 3D chip multiprocessors using network-in-memory","author":"li","year":"2006","journal-title":"International Symposium on Computer Architecture"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.64"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DSD.2007.4341521"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.4378783"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2008.142"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/378239.379048"}],"event":{"name":"APCCAS 2010-2010 IEEE Asia Pacific Conference on Circuits and Systems","start":{"date-parts":[[2010,12,6]]},"location":"Kuala Lumpur, Malaysia","end":{"date-parts":[[2010,12,9]]}},"container-title":["2010 IEEE Asia Pacific Conference on Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5767825\/5774732\/05774962.pdf?arnumber=5774962","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T00:54:22Z","timestamp":1497920062000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5774962\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,12]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/apccas.2010.5774962","relation":{},"subject":[],"published":{"date-parts":[[2010,12]]}}}