{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,17]],"date-time":"2026-04-17T12:29:50Z","timestamp":1776428990386,"version":"3.51.2"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,11,11]],"date-time":"2022-11-11T00:00:00Z","timestamp":1668124800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,11,11]],"date-time":"2022-11-11T00:00:00Z","timestamp":1668124800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2204500"],"award-info":[{"award-number":["2019YFB2204500"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61904104"],"award-info":[{"award-number":["61904104"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,11,11]]},"DOI":"10.1109\/apccas55924.2022.10090278","type":"proceedings-article","created":{"date-parts":[[2023,4,11]],"date-time":"2023-04-11T13:25:39Z","timestamp":1681219539000},"page":"314-318","source":"Crossref","is-referenced-by-count":3,"title":["Store, Supply, Extract and Recycle: A Boost\/Buck Reconfigurable Converter for Thermal Energy Harvesting"],"prefix":"10.1109","author":[{"given":"Mengli","family":"Zou","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,Shanghai,China"}]},{"given":"Xinzi","family":"Xu","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,Shanghai,China"}]},{"given":"Qiao","family":"Cai","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,Shanghai,China"}]},{"given":"Yanxing","family":"Suo","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,Shanghai,China"}]},{"given":"Tianwei","family":"Wan","sequence":"additional","affiliation":[{"name":"Qingdao Tianzhuo Technology Investment Holding Co. LTD,Qingdao,China"}]},{"given":"Jian","family":"Zhao","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,Shanghai,China"}]},{"given":"Yang","family":"Zhao","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro\/Nano Electronics,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICSICT49897.2020.9278256"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-014-3046-0"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2863951"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2924095"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2042251"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5433835"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2869328"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2015.7063087"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2015.2503350"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2573382"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2434099"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2563782"}],"event":{"name":"2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)","location":"Shenzhen, China","start":{"date-parts":[[2022,11,11]]},"end":{"date-parts":[[2022,11,13]]}},"container-title":["2022 IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10090225\/10090247\/10090278.pdf?arnumber=10090278","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,15]],"date-time":"2025-10-15T17:32:03Z","timestamp":1760549523000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10090278\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,11,11]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/apccas55924.2022.10090278","relation":{},"subject":[],"published":{"date-parts":[[2022,11,11]]}}}