{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,21]],"date-time":"2026-04-21T16:23:43Z","timestamp":1776788623323,"version":"3.51.2"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,31]],"date-time":"2023-10-31T00:00:00Z","timestamp":1698710400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,31]],"date-time":"2023-10-31T00:00:00Z","timestamp":1698710400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100006190","name":"Research and Development","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100006190","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002701","name":"Ministry of Education","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100002701","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,31]]},"DOI":"10.1109\/apsipaasc58517.2023.10317264","type":"proceedings-article","created":{"date-parts":[[2023,11,20]],"date-time":"2023-11-20T19:07:46Z","timestamp":1700507266000},"page":"2173-2177","source":"Crossref","is-referenced-by-count":2,"title":["Application of Wafer Defect Pattern Classification Model in the Semiconductor Industry"],"prefix":"10.1109","author":[{"given":"Chin-Wei","family":"Lee","sequence":"first","affiliation":[{"name":"Soochow University,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniel","family":"Hl\u00e1dek","sequence":"additional","affiliation":[{"name":"Technical University in Košice,Slovakia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mat\u00fa\u0161","family":"Pleva","sequence":"additional","affiliation":[{"name":"Technical University in Košice,Slovakia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan-Fu","family":"Liao","sequence":"additional","affiliation":[{"name":"National Yang Ming Chiao Tung University,HsinChu,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ming-Hsiang","family":"Su","sequence":"additional","affiliation":[{"name":"Soochow University,Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Extraordinary semiconductor cycle triggered by one-time events, cyclical and geopolitical effects","volume-title":"Germany Monitor","author":"Rapp","year":"2022"},{"key":"ref2","article-title":"A secondary sources analysis of the business models and supply chain strategies of semiconductor manufacturers","volume-title":"Master of Science thesis","author":"OLIVIERI","year":"2021"},{"key":"ref3","article-title":"Design and Fabrication of Semi-Auto Wafer Scriber for 4-in and 8-in Wafers","volume-title":"Doctoral dissertation","author":"TARMIZI","year":"2018"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2022.108614"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2016.12.038"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/S0169-7439(97)00061-0"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICEngTechnol.2017.8308186"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICSSIT46314.2019.8987837"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.4249\/scholarpedia.1883"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCS45141.2019.9065747"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/2051-672X\/ab1ca3"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.38094\/jastt20165"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2018.2806931"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1016\/j.engappai.2012.03.016"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.21275\/v5i1.NOV153131"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4899-7641-3"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.neucom.2019.10.118"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2022.3146849"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1002\/jcb.10073"},{"key":"ref20","volume-title":"Digital Image Processing","author":"Gonzalez","year":"2008"},{"key":"ref21","article-title":"Computer vision: Overview","volume-title":"Computer and Robot Vision","author":"Haralock","year":"1992"},{"issue":"1","key":"ref22","first-page":"41","article-title":"A comparison of event models for naive bayes text classification","volume-title":"AAAI-98 workshop on learning for text categorization","volume":"752","author":"McCallum"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ASMC57536.2023.10121119"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2014.2364237"}],"event":{"name":"2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC)","location":"Taipei, Taiwan","start":{"date-parts":[[2023,10,31]]},"end":{"date-parts":[[2023,11,3]]}},"container-title":["2023 Asia Pacific Signal and Information Processing Association Annual Summit and Conference (APSIPA ASC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10317071\/10317095\/10317264.pdf?arnumber=10317264","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T18:49:28Z","timestamp":1709405368000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10317264\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,31]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/apsipaasc58517.2023.10317264","relation":{},"subject":[],"published":{"date-parts":[[2023,10,31]]}}}