{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,18]],"date-time":"2025-06-18T02:28:03Z","timestamp":1750213683587,"version":"3.28.0"},"reference-count":8,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,10]]},"DOI":"10.1109\/asicon.2011.6157175","type":"proceedings-article","created":{"date-parts":[[2012,2,28]],"date-time":"2012-02-28T20:44:14Z","timestamp":1330461854000},"page":"275-278","source":"Crossref","is-referenced-by-count":8,"title":["A novel multi-finger layout strategy for GGnMOS ESD protection device"],"prefix":"10.1109","author":[{"family":"Peng Zhang","sequence":"first","affiliation":[]},{"family":"Yuan Wang","sequence":"additional","affiliation":[]},{"family":"Song Jia","sequence":"additional","affiliation":[]},{"family":"Xing Zhang","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"crossref","first-page":"2601","DOI":"10.1109\/JSSC.2006.883331","volume":"41","author":"ming-dou","year":"2006","journal-title":"Solid-State Circuits"},{"key":"2","first-page":"234","author":"jiang","year":"1996","journal-title":"Reliability Physics IRPS Symp"},{"journal-title":"ESD Test Standard","year":"1998","key":"1"},{"key":"7","doi-asserted-by":"crossref","first-page":"379","DOI":"10.1109\/16.121697","volume":"39","author":"polgreen","year":"1992","journal-title":"Electron Devices"},{"key":"6","doi-asserted-by":"crossref","first-page":"2171","DOI":"10.1109\/TED.2002.805049","volume":"49","author":"oh","year":"2002","journal-title":"Electron Devices"},{"key":"5","doi-asserted-by":"crossref","first-page":"190","DOI":"10.1109\/7298.995833","volume":"1","author":"chen","year":"2001","journal-title":"Device Mater Reliability"},{"key":"4","first-page":"162","author":"lee","year":"1999","journal-title":"IPFA Proc"},{"key":"8","first-page":"177","author":"russ","year":"1998","journal-title":"EOS\/ESD Symp"}],"event":{"name":"2011 IEEE 9th International Conference on ASIC (ASICON 2011)","start":{"date-parts":[[2011,10,25]]},"location":"Xiamen, China","end":{"date-parts":[[2011,10,28]]}},"container-title":["2011 9th IEEE International Conference on ASIC"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6153219\/6157041\/06157175.pdf?arnumber=6157175","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T14:57:12Z","timestamp":1497970632000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6157175\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,10]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/asicon.2011.6157175","relation":{},"subject":[],"published":{"date-parts":[[2011,10]]}}}