{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,3]],"date-time":"2024-09-03T18:11:47Z","timestamp":1725387107073},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,10]]},"DOI":"10.1109\/asicon.2011.6157274","type":"proceedings-article","created":{"date-parts":[[2012,2,28]],"date-time":"2012-02-28T20:44:14Z","timestamp":1330461854000},"page":"590-593","source":"Crossref","is-referenced-by-count":0,"title":["Low noise low power two-stage modulator with injection locked LO divider in 65nm CMOS"],"prefix":"10.1109","author":[{"family":"Wufeng Wang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Peichen Jiang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Tingting Mo","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jianjun Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","first-page":"120","article-title":"Single-chip multiband WCDMA\/HSDPA\/HSUPA \/EGPRS transceiver with diversity receiver and 30 DigRF interface without SAW filters in transmitter\/3G receiver paths","author":"sowlati","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Feb 2009"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2010.2042851"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2009.5135594"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/4.818916"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/82.769778"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2010.2042851"},{"key":"4","first-page":"120","article-title":"A 45 nm low-power SAW-less WCDMA transmit modulator using direct quadrature voltage modulation","author":"he","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Feb 2009"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/SMIC.2010.5422946"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2004.1358826"}],"event":{"name":"2011 IEEE 9th International Conference on ASIC (ASICON 2011)","start":{"date-parts":[[2011,10,25]]},"location":"Xiamen, China","end":{"date-parts":[[2011,10,28]]}},"container-title":["2011 9th IEEE International Conference on ASIC"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6153219\/6157041\/06157274.pdf?arnumber=6157274","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T15:24:21Z","timestamp":1490109861000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6157274\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,10]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/asicon.2011.6157274","relation":{},"subject":[],"published":{"date-parts":[[2011,10]]}}}