{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T10:11:20Z","timestamp":1729678280771,"version":"3.28.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/asicon.2015.7517018","type":"proceedings-article","created":{"date-parts":[[2016,7,26]],"date-time":"2016-07-26T20:38:31Z","timestamp":1469565511000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Smartphone-controlled electro-wetting on dielectric microfluidics"],"prefix":"10.1109","author":[{"given":"Zhi","family":"Zeng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kaidi","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weijiang","family":"Xu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jia","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1039\/c3lc50431j"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1039\/C3LC51375K"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1039\/c3lc50976a"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1039\/c3lc51194d"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1021\/ac502137s"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.snb.2014.03.112"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(01)00734-8"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1039\/C4LC00592A"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.4807118"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1039\/c3lc50170a"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"4076","DOI":"10.1039\/C4LC00443D","volume":"14","author":"haig","year":"2014","journal-title":"Lab on a Chip"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"1747","DOI":"10.1163\/156856111X599562","volume":"26","author":"nelson wyatt","year":"2012","journal-title":"Journal of Adhesion Science and Technology"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/0925-4005(90)80209-I"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1039\/C4LC00142G"}],"event":{"name":"2015 IEEE 11th International Conference on ASIC (ASICON )","start":{"date-parts":[[2015,11,3]]},"location":"Chengdu, China","end":{"date-parts":[[2015,11,6]]}},"container-title":["2015 IEEE 11th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7506193\/7516874\/07517018.pdf?arnumber=7517018","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,3]],"date-time":"2022-07-03T21:35:35Z","timestamp":1656884135000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7517018\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/asicon.2015.7517018","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}