{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,11]],"date-time":"2025-06-11T13:47:55Z","timestamp":1749649675570},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/asicon.2015.7517041","type":"proceedings-article","created":{"date-parts":[[2016,7,26]],"date-time":"2016-07-26T16:38:31Z","timestamp":1469551111000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["A high efficiency all-PMOS charge pump for 3D NAND flash memory"],"prefix":"10.1109","author":[{"given":"Liyin","family":"Fu","sequence":"first","affiliation":[]},{"given":"Yu","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Qi","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Shiyang","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Yan","family":"Yang","sequence":"additional","affiliation":[]},{"given":"Zongliang","family":"Huo","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","first-page":"374","author":"dickson","year":"1976","journal-title":"IEEE JSSC"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.811991"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/4.859515"},{"key":"ref13","doi-asserted-by":"crossref","first-page":"964","DOI":"10.1109\/TVLSI.2008.2008832","author":"richelli","year":"2009","journal-title":"IEEE VLSI Systems"},{"key":"ref14","first-page":"522","author":"richelli","year":"2007","journal-title":"IEEE ISSCC"},{"key":"ref4","first-page":"192","author":"jang","year":"2009","journal-title":"Dig Symp VLSI Tech"},{"key":"ref3","first-page":"22","author":"maeda","year":"2009","journal-title":"Dig Symp VLSI Circuits"},{"key":"ref6","first-page":"130","author":"woo","year":"2015","journal-title":"IEEE ISSCC"},{"key":"ref5","first-page":"334","author":"park","year":"2014","journal-title":"IEEE ISSCC"},{"key":"ref8","first-page":"497","author":"lee","year":"2003","journal-title":"Proc Int Reliability Physics Symposium"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2010.5556216"},{"key":"ref2","first-page":"9","author":"park","year":"2008","journal-title":"ISSCC Dig Tech"},{"journal-title":"Dig Symp VLSI Tech","first-page":"14","year":"2007","key":"ref1"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2159722"}],"event":{"name":"2015 IEEE 11th International Conference on ASIC (ASICON )","start":{"date-parts":[[2015,11,3]]},"location":"Chengdu, China","end":{"date-parts":[[2015,11,6]]}},"container-title":["2015 IEEE 11th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7506193\/7516874\/07517041.pdf?arnumber=7517041","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,24]],"date-time":"2017-06-24T15:15:12Z","timestamp":1498317312000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7517041\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/asicon.2015.7517041","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}