{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T13:28:05Z","timestamp":1725542885076},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/asicon.2015.7517140","type":"proceedings-article","created":{"date-parts":[[2016,7,26]],"date-time":"2016-07-26T20:38:31Z","timestamp":1469565511000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Design and testing of CMOS compatible EEPROM"],"prefix":"10.1109","author":[{"given":"Haibin","family":"Yin","sequence":"first","affiliation":[]},{"given":"Xiaohong","family":"Peng","sequence":"additional","affiliation":[]},{"given":"Peiyuan","family":"Wan","sequence":"additional","affiliation":[]},{"given":"Jinhui","family":"Wang","sequence":"additional","affiliation":[]},{"given":"Ligang","family":"Hou","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/4.5938"},{"first-page":"152","year":"0","author":"johnson","key":"ref3"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1976.1050739"},{"key":"ref6","first-page":"1","author":"baek","year":"2010","journal-title":"Solid State Circuits Conference (A-SSCC)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2003.814988"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2010.06.006"},{"key":"ref7","first-page":"1540","author":"yin","year":"2014","journal-title":"Solid-State and Integrated Circuit Technology (ICSICT)"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1982.1051827"},{"first-page":"18","year":"0","author":"schuegraf","key":"ref9"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/j.1538-7305.1967.tb01738.x"}],"event":{"name":"2015 IEEE 11th International Conference on ASIC (ASICON )","start":{"date-parts":[[2015,11,3]]},"location":"Chengdu, China","end":{"date-parts":[[2015,11,6]]}},"container-title":["2015 IEEE 11th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7506193\/7516874\/07517140.pdf?arnumber=7517140","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T16:38:56Z","timestamp":1489768736000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7517140\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/asicon.2015.7517140","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}