{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,15]],"date-time":"2025-11-15T17:06:37Z","timestamp":1763226397423},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2015,11]]},"DOI":"10.1109\/asicon.2015.7517149","type":"proceedings-article","created":{"date-parts":[[2016,7,26]],"date-time":"2016-07-26T20:38:31Z","timestamp":1469565511000},"page":"1-4","source":"Crossref","is-referenced-by-count":7,"title":["A crosstalk avoidance scheme based on re-layout of signal TSV"],"prefix":"10.1109","author":[{"given":"Jiayi","family":"Hu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qin","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jianfei","family":"Jiang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jing","family":"Xie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhigang","family":"Mao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742982"},{"key":"ref3","first-page":"417","article-title":"Electrical simulation of $3\\times 3$ TSV array with different signal and ground patterns","author":"pang","year":"2013","journal-title":"The 13th International Conference on Electronic Packaging Technology (ICEPT)"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2013.6572422"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509678"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/4235.996017"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IMOC.2009.5427502"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2001.968598"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.338"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2007.4397333"}],"event":{"name":"2015 IEEE 11th International Conference on ASIC (ASICON )","start":{"date-parts":[[2015,11,3]]},"location":"Chengdu, China","end":{"date-parts":[[2015,11,6]]}},"container-title":["2015 IEEE 11th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7506193\/7516874\/07517149.pdf?arnumber=7517149","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T16:43:15Z","timestamp":1489768995000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7517149\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2015,11]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/asicon.2015.7517149","relation":{},"subject":[],"published":{"date-parts":[[2015,11]]}}}