{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T17:54:42Z","timestamp":1729619682118,"version":"3.28.0"},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,10]]},"DOI":"10.1109\/asicon.2017.8252398","type":"proceedings-article","created":{"date-parts":[[2018,1,17]],"date-time":"2018-01-17T22:22:30Z","timestamp":1516227750000},"page":"6-11","source":"Crossref","is-referenced-by-count":1,"title":["Development trends of embedded NVM technology"],"prefix":"10.1109","author":[{"given":"TianShen","family":"Tang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hao","family":"Ni","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zijian","family":"Zhao","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yao","family":"Zhou","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"718","author":"chan","year":"1987","journal-title":"International Electron Devices Meeting (IEDM)"},{"key":"ref11","first-page":"714","author":"chang","year":"1987","journal-title":"International Electron Devices Meeting (IEDM)"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"734","DOI":"10.1109\/16.285025","author":"chen","year":"1994","journal-title":"IEEE Transactions on Electron Devices (TED)"},{"key":"ref13","first-page":"101","author":"postel-pellerin","year":"2016","journal-title":"Proceedings of International Semiconductor Conference (CAS)"},{"key":"ref14","doi-asserted-by":"crossref","first-page":"295","DOI":"10.1109\/IEDM.1997.650385","author":"chung","year":"1997","journal-title":"International Electron Devices Meeting (IEDM)"},{"key":"ref15","first-page":"9.4.1","author":"robert","year":"2011","journal-title":"International Electron Devices Meeting (IEDM)"},{"key":"ref16","doi-asserted-by":"crossref","first-page":"841p","DOI":"10.1109\/16.831002","volume":"47","author":"ruei-ling","year":"2000","journal-title":"Programmable Microelectronics Corporation (PMC) IEEE TRANSACTIONS ON ELECTRON DEVICES"},{"key":"ref17","first-page":"287","author":"shih-jye","year":"1997","journal-title":"Programmable Microelectronics Corp USA"},{"key":"ref4","first-page":"46","author":"latt tee","year":"2015","journal-title":"IEEE International Memory Workshop (IMW)"},{"key":"ref3","first-page":"185","author":"baker","year":"2009","journal-title":"IEEE International Conference on IC Design & Technology"},{"key":"ref6","first-page":"1866","author":"takahiro","year":"1999","journal-title":"IEEE Transactions on Electron Devices (TED)"},{"key":"ref5","first-page":"67","author":"chung","year":"2001","journal-title":"IEEE International Reliability Physics Symposium Proceedings 39th Annual"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.1995.499196"},{"key":"ref7","first-page":"139","author":"shum","year":"2012","journal-title":"IEEE International Memory Workshop (IMW)"},{"key":"ref2","first-page":"101","author":"torres","year":"2013","journal-title":"IEEE International Symposium on Circuits and Systems"},{"key":"ref1","first-page":"109","author":"chen","year":"2015","journal-title":"Proc European Solid-State Device Research Conference (ESSDERC)"},{"key":"ref9","doi-asserted-by":"crossref","first-page":"1248","DOI":"10.1109\/5.622505","author":"pavan","year":"1997","journal-title":"Proceedings of the IEEE"}],"event":{"name":"2017 IEEE 12th International Conference on ASIC (ASICON)","start":{"date-parts":[[2017,10,25]]},"location":"Guiyang","end":{"date-parts":[[2017,10,28]]}},"container-title":["2017 IEEE 12th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8240668\/8252386\/08252398.pdf?arnumber=8252398","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,9]],"date-time":"2019-10-09T13:29:01Z","timestamp":1570627741000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8252398\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/asicon.2017.8252398","relation":{},"subject":[],"published":{"date-parts":[[2017,10]]}}}