{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,2]],"date-time":"2025-09-02T00:03:58Z","timestamp":1756771438815,"version":"3.44.0"},"reference-count":13,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983466","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["A Optimized PPD CMOS Pixel with 26.09 % Transfer Efficiency Improvement and 43.34 % Crosstalk Suppression for I-ToF Application"],"prefix":"10.1109","author":[{"given":"Junwei","family":"Yang","sequence":"first","affiliation":[{"name":"College of Information and Electronics Engineering, Shenzhen University,Shenzhen, Guangdong,China,518060"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weiwei","family":"Shi","sequence":"additional","affiliation":[{"name":"College of Information and Electronics Engineering, Shenzhen University,Shenzhen, Guangdong,China,518060"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhiyu","family":"Huang","sequence":"additional","affiliation":[{"name":"College of Information and Electronics Engineering, Shenzhen University,Shenzhen, Guangdong,China,518060"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan","family":"Xu","sequence":"additional","affiliation":[{"name":"College of Big Data and Internet, Shenzhen Technology University,Shenzhen, Guangdong,China,518060"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yanghao","family":"Zheng","sequence":"additional","affiliation":[{"name":"College of Information and Electronics Engineering, Shenzhen University,Shenzhen, Guangdong,China,518060"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xuanbin","family":"Fang","sequence":"additional","affiliation":[{"name":"College of Information and Electronics Engineering, Shenzhen University,Shenzhen, Guangdong,China,518060"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","article-title":"A 413x240-pixel sub-centimeter resolution Time-of-Flight CMOS image sensor with in-pixel background canceling using lateral-electric-field charge modulators","author":"han","year":"2014","journal-title":"Solid-State Circuits Conference Digest of Technical Papers"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/3.910448"},{"key":"ref12","first-page":"3965","article-title":"Demodulation pixels in CCD and CMOS technologies for time-of-flight ranging","author":"seitz","year":"0","journal-title":"Proc SPIE"},{"key":"ref13","article-title":"A CMOS photodiode model","author":"liu","year":"0","journal-title":"Proc IEEE\/ACM Int Workshop Behav Modeling Simulation"},{"key":"ref4","article-title":"Design and Characterization of a Current Assisted Photo Mixing Demodulator for Tof Based 3d Cmos Image Sensor","author":"hossain","year":"2010","journal-title":"University of Trento"},{"key":"ref3","article-title":"TOF-Range Image Sensor in 0.18um CMOS technology based on Current Assisted Photonic Demodulators","author":"stoppa","year":"2011","journal-title":"Conf Lasers and Electro-Optics"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2007.907561"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2789403"},{"key":"ref8","article-title":"Time of flight image sensor with 7um pixel and 640x480 resolution","author":"kim","year":"2013","journal-title":"VLSI Technology"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2014.2301875"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/3DTV.2007.4379472"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2010.2101060"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2017.2677201"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983466.pdf?arnumber=8983466","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T19:23:19Z","timestamp":1756754599000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983466\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983466","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}