{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T19:02:11Z","timestamp":1754161331866,"version":"3.41.2"},"reference-count":12,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983484","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Area-Efficient Parallel Stochastic Computing with Shared Weighted Binary Generator"],"prefix":"10.1109","author":[{"given":"Lun","family":"Zhang","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro and Nano Electronics,Shanghai,China"}]},{"given":"Weikang","family":"Qian","sequence":"additional","affiliation":[{"name":"MoE Key Lab of Artificial Intelligence, Shanghai Jiao Tong University,Shanghai,China"}]},{"given":"Hai-Bao","family":"Chen","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro and Nano Electronics,Shanghai,China"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP.2013.6638146"},{"key":"ref3","first-page":"136:1","article-title":"Stochastic circuits for realtime image-processing applications","author":"alaghi","year":"0","journal-title":"Design Automation Conference"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2018.00037"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/SiPS.2013.6674504"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/29.1564"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898011"},{"journal-title":"Semiconductor Manufacturing International Corporation (SMIC)","article-title":"SMIC 40nm technology","year":"0","key":"ref12"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2016.2608825"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203837"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2778107"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2603465"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4899-5841-9_2"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983484.pdf?arnumber=8983484","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,28]],"date-time":"2025-07-28T19:40:31Z","timestamp":1753731631000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983484\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983484","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}