{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:01:23Z","timestamp":1755799283005,"version":"3.44.0"},"reference-count":10,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983527","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Improve DRAM Leakage Issue During RAS Operational Phase Through TCAD Simulation"],"prefix":"10.1109","author":[{"given":"Ning","family":"Li","sequence":"first","affiliation":[{"name":"Product Research and Development, ChangXin Memory Technologies, Inc.,Hefei,China,230000"}]},{"given":"Wen-Yang","family":"Jiang","sequence":"additional","affiliation":[{"name":"Product Research and Development, ChangXin Memory Technologies, Inc.,Hefei,China,230000"}]},{"given":"Blacksmith","family":"Wu","sequence":"additional","affiliation":[{"name":"Product Research and Development, ChangXin Memory Technologies, Inc.,Hefei,China,230000"}]},{"given":"Kanyu","family":"Cao","sequence":"additional","affiliation":[{"name":"Product Research and Development, ChangXin Memory Technologies, Inc.,Hefei,China,230000"}]}],"member":"263","reference":[{"key":"ref4","first-page":"22","author":"kang","year":"2009","journal-title":"Conference on Optical Fiber Communication - incudes post deadline papers"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"187","DOI":"10.1147\/rd.462.0187","author":"mandelman","year":"2002","journal-title":"IBM Journal of Research and Development"},{"key":"ref10","first-page":"39","volume":"1","author":"ghetti","year":"2004","journal-title":"IEDM Technical Digest IEEE International"},{"key":"ref6","first-page":"25","author":"bazizi","year":"0","journal-title":"2014 International Conference on Simulation of Semiconductor Processes and Devices"},{"journal-title":"Sdevice User Guide","year":"2017","author":"sentaurus","key":"ref5"},{"key":"ref8","first-page":"812","author":"geshu","year":"1991","journal-title":"IEICE Transactions on Electronics"},{"key":"ref7","doi-asserted-by":"crossref","first-page":"617","DOI":"10.1016\/0038-1101(91)90136-M","author":"bordelon","year":"1991","journal-title":"Solid-State Electronics"},{"key":"ref2","first-page":"24","author":"slater","year":"1993","journal-title":"1993 IEEE International Solid-State Circuits Conference Digest of Technical Papers"},{"key":"ref9","first-page":"1660","author":"goudarzi","year":"2008","journal-title":"IEEE Transactions on very large scale integration Systems"},{"key":"ref1","first-page":"26","author":"huo","year":"0","journal-title":"2006 64th Device Research Conference"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983527.pdf?arnumber=8983527","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,19]],"date-time":"2025-08-19T18:11:14Z","timestamp":1755627074000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983527\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983527","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}