{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,21]],"date-time":"2025-08-21T18:02:38Z","timestamp":1755799358781,"version":"3.44.0"},"reference-count":8,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983531","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":5,"title":["Design of CMOS integrated circuits for radiation hardening and its application to space electronics"],"prefix":"10.1109","author":[{"given":"Yann","family":"Deval","sequence":"first","affiliation":[{"name":"Univ. Bordeaux, Bordeaux INP, CNRS UMR5218, Laboratoire IMS,Talence,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Herv\u00e9","family":"Lapuyade","sequence":"additional","affiliation":[{"name":"Univ. Bordeaux, Bordeaux INP, CNRS UMR5218, Laboratoire IMS,Talence,France"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Fran\u00e7ois","family":"Rivet","sequence":"additional","affiliation":[{"name":"Univ. Bordeaux, Bordeaux INP, CNRS UMR5218, Laboratoire IMS,Talence,France"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2009.2039633"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/23.387358"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2014.2312269"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/NSSMIC.1999.842517"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2014.2321772"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/55.57923"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.30.1333"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/23.488751"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983531.pdf?arnumber=8983531","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,19]],"date-time":"2025-08-19T18:11:18Z","timestamp":1755627078000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983531\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":8,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983531","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}