{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T06:15:44Z","timestamp":1763705744084,"version":"3.44.0"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983571","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["An Energy-Efficient Mixed-Signal Parallel Multiply-Accumulate (MAC) Engine Based on Stochastic Computing"],"prefix":"10.1109","author":[{"given":"Xinyue","family":"Zhang","sequence":"first","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]},{"given":"Jiahao","family":"Song","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]},{"given":"Yuan","family":"Wang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]},{"given":"Yawen","family":"Zhang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]},{"given":"Zuodong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]},{"given":"Runsheng","family":"Wang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"Institute of Microelectronics and Key Laboratory of Microelectronics Devices and Circuits (MoE), Peking University,Beijing,P.R. China,100871"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1049\/el.2014.3995"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2016.7844125"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2000.911498"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2006.1693099"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2016.7527177"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898011"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2902961.2902978"},{"key":"ref6","first-page":"222","article-title":"An always-on 3.8µJ\/86% CIFAR-10 mixed-signal binary CNN processor with all memory on chip in 28nm CMOS","author":"bankman","year":"0","journal-title":"IEEE Int Solid-State Circuit Conf (ISSCC)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2360331"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2966988"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICICDT.2019.8790878"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268342"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2017.2761740"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.23919\/SNW.2019.8782977"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983571.pdf?arnumber=8983571","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,19]],"date-time":"2025-08-19T18:11:18Z","timestamp":1755627078000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983571\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983571","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}