{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,9,23]],"date-time":"2025-09-23T14:21:48Z","timestamp":1758637308833,"version":"3.44.0"},"reference-count":36,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983679","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Impact of Device Architecture and Gate Stack Processing on the Low-Frequency Noise of Silicon Nanowire Transistors"],"prefix":"10.1109","author":[{"given":"Eddy","family":"Simoen","sequence":"first","affiliation":[{"name":"Imec,Kapeldreef 75, Leuven,Belgium,B-3001"}]},{"given":"Alberto Vinicius","family":"Oliveira","sequence":"additional","affiliation":[{"name":"UTFPR,Campus Toledo, Paraná,Brazil"}]},{"given":"Anabela","family":"Veloso","sequence":"additional","affiliation":[{"name":"Imec,Kapeldreef 75, Leuven,Belgium,B-3001"}]},{"given":"Adrian Vaisman","family":"Chasin","sequence":"additional","affiliation":[{"name":"Imec,Kapeldreef 75, Leuven,Belgium,B-3001"}]},{"given":"Romain","family":"Ritzenthaler","sequence":"additional","affiliation":[{"name":"Imec,Kapeldreef 75, Leuven,Belgium,B-3001"}]},{"given":"Hans","family":"Mertens","sequence":"additional","affiliation":[{"name":"Imec,Kapeldreef 75, Leuven,Belgium,B-3001"}]},{"given":"Naoto","family":"Horiguchi","sequence":"additional","affiliation":[{"name":"Imec,Kapeldreef 75, Leuven,Belgium,B-3001"}]},{"given":"Cor","family":"Claeys","sequence":"additional","affiliation":[{"name":"EE Depart. KU Leuven,Kasteelpark Arenberg 10, Leuven,Belgium,B-3001"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1149\/08004.0069ecst"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2006.05.007"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2016.2530849"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/0038-1101(95)00011-H"},{"journal-title":"unpublished results","year":"0","author":"oliveira","key":"ref36"},{"journal-title":"submitted for presentation at SSDM","year":"2019","author":"veloso","key":"ref35"},{"key":"ref34","doi-asserted-by":"crossref","DOI":"10.1149\/2.0151803jss","volume":"7","author":"claeys","year":"2018","journal-title":"ECS Journal of Solid State Science and Technology"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1063\/1.4829465"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1063\/1.3569724"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.3557505"},{"journal-title":"Proc of the IEEE Int SOI Conf IEEE Xplore","year":"0","author":"doria","key":"ref13"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1149\/1.3570779"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2011.2169645"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2012.2213575"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2012.12.003"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1063\/1.4965851"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2016.2542924"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2295025"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1088\/1361-648X\/aad7c7"},{"key":"ref27","first-page":"273","volume":"ed 19","author":"fu","year":"1972","journal-title":"IEEE Trans Electron Devices"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1149\/07202.0085ecst"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2011.02.016"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2018.2799617"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1038\/nnano.2010.15"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1063\/1.4902549"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1063\/1.4767353"},{"key":"ref2","first-page":"138","author":"veloso","year":"0","journal-title":"Symp VLSI Technol Tech Dig"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1063\/1.4937901"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.2211320226"},{"key":"ref20","first-page":"11804","volume":"34","author":"opondo","year":"2016","journal-title":"Sci Technol B"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.sse.2016.10.013"},{"key":"ref21","first-page":"34","author":"mukherjee","year":"0","journal-title":"European Solid State Device Research Conf IEEE Xplore"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/S0038-1101(98)00322-0"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1002\/pssa.2211240225"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2013.2275917"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2714(02)00025-2"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983679.pdf?arnumber=8983679","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T19:23:21Z","timestamp":1756754601000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983679\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":36,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983679","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}