{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T19:46:55Z","timestamp":1754164015343,"version":"3.41.2"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,10,1]],"date-time":"2019-10-01T00:00:00Z","timestamp":1569888000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,10]]},"DOI":"10.1109\/asicon47005.2019.8983682","type":"proceedings-article","created":{"date-parts":[[2020,2,7]],"date-time":"2020-02-07T01:04:26Z","timestamp":1581037466000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["SPICE Modeling and Simulation of High-Performance Wafer-Scale MoS<sub>2<\/sub> Transistors"],"prefix":"10.1109","author":[{"given":"Yuting","family":"Yao","sequence":"first","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]},{"given":"Manxin","family":"Li","sequence":"additional","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]},{"given":"Tianxiang","family":"Wu","sequence":"additional","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]},{"given":"Hu","family":"Xu","sequence":"additional","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]},{"given":"Shunli","family":"Ma","sequence":"additional","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]},{"given":"Wenzhong","family":"Bao","sequence":"additional","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]},{"given":"Junyan","family":"Ren","sequence":"additional","affiliation":[{"name":"Skate Key Laboratory of ASIC and System, Fudan University,Shanghai,China,200433"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"7904","DOI":"10.1021\/nn506512j","author":"liu","year":"2015","journal-title":"ACS Nano"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"147","DOI":"10.1038\/nnano.2010.279","author":"radisaclijevic","year":"2011","journal-title":"Nature Nanotechnol"},{"key":"ref6","volume":"14","author":"xu","year":"2018","journal-title":"Nano Micro Small"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2913699"},{"key":"ref7","first-page":"1","author":"huang","year":"0","journal-title":"IEEE International Symposium on Circuits and Systems (ISCAS)"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"6349","DOI":"10.1021\/acs.nanolett.6b02739","author":"yu","year":"2016","journal-title":"Dina El-Damak and Ujwal Radhakrishna Nano Letters"},{"key":"ref1","doi-asserted-by":"crossref","first-page":"893","DOI":"10.1109\/LED.2018.2830400","author":"cao","year":"2018","journal-title":"IEEE Electron Device Letters"}],"event":{"name":"2019 IEEE 13th International Conference on ASIC (ASICON)","start":{"date-parts":[[2019,10,29]]},"location":"Chongqing, China","end":{"date-parts":[[2019,11,1]]}},"container-title":["2019 IEEE 13th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8963812\/8983425\/08983682.pdf?arnumber=8983682","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,31]],"date-time":"2025-07-31T18:26:23Z","timestamp":1753986383000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8983682\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,10]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/asicon47005.2019.8983682","relation":{},"subject":[],"published":{"date-parts":[[2019,10]]}}}