{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T15:49:29Z","timestamp":1781884169904,"version":"3.54.5"},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,10,26]],"date-time":"2021-10-26T00:00:00Z","timestamp":1635206400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,10,26]],"date-time":"2021-10-26T00:00:00Z","timestamp":1635206400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,10,26]]},"DOI":"10.1109\/asicon52560.2021.9620465","type":"proceedings-article","created":{"date-parts":[[2021,12,1]],"date-time":"2021-12-01T20:53:36Z","timestamp":1638392016000},"page":"1-4","source":"Crossref","is-referenced-by-count":6,"title":["TCAD Simulation of Novel Semiconductor Devices"],"prefix":"10.1109","author":[{"given":"Tapas","family":"Dutta","sequence":"first","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Cristina","family":"Medina-Bailon","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ali","family":"Rezaei","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daniel","family":"Nagy","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fikru","family":"Adamu-Lema","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Nikolas","family":"Xeni","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yassine","family":"Abourrig","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Naveen","family":"Kumar","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vihar P.","family":"Georgiev","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Asen","family":"Asenov","sequence":"additional","affiliation":[{"name":"University of Glasgow,Device Modelling Group, School of Engineering,Glasgow,Scotland,UK,G128LT"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref2","first-page":"22","volume-title":"International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","author":"Berrada"},{"key":"ref3","doi-asserted-by":"crossref","first-page":"1031","DOI":"10.1007\/s10825-020-01519-0","volume":"19","author":"Berrada","year":"2020","journal-title":"J. Comput. Electron."},{"issue":"4","key":"ref4","doi-asserted-by":"crossref","first-page":"20030404","DOI":"10.33079\/jomm.20030404","volume":"3","author":"Medina-Bailon","year":"2020","journal-title":"J. Microelectronic Manufacturing"},{"issue":"6","key":"ref5","doi-asserted-by":"crossref","first-page":"680","DOI":"10.3390\/mi12060680","volume":"12","author":"Medina-Bailon","year":"2021","journal-title":"Micromachines"},{"issue":"9","key":"ref6","doi-asserted-by":"crossref","first-page":"1895","DOI":"10.3390\/app9091895","volume":"9","author":"Badami","year":"2019","journal-title":"Applied Sciences"},{"key":"ref7","article-title":"Atomistix ToolKit","volume-title":"QuantumWise A\/S"},{"key":"ref8","first-page":"1","volume-title":"14th IEEE Nanotechnology Materials and Devices Conference (NMDC)","author":"Dutta"},{"issue":"1","key":"ref9","doi-asserted-by":"crossref","first-page":"65","DOI":"10.1007\/s10825-011-0356-9","volume":"10","author":"Ancona","year":"2011","journal-title":"J. Comp. Electron."},{"key":"ref10","doi-asserted-by":"crossref","first-page":"155430","DOI":"10.1103\/PhysRevB.80.155430","volume":"80","author":"Luisier","year":"2009","journal-title":"Phys. Rev. B"},{"issue":"1","key":"ref11","doi-asserted-by":"crossref","first-page":"124","DOI":"10.3390\/ma12010124","volume":"12","author":"Sadi","year":"2019","journal-title":"Materials"},{"issue":"10","key":"ref12","doi-asserted-by":"crossref","first-page":"1571","DOI":"10.1109\/LED.2019.2934349","volume":"40","author":"Medina-Bailon","year":"2019","journal-title":"IEEE Electron Device Letters"},{"key":"ref13","first-page":"273","volume-title":"International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","author":"Lapham"},{"issue":"7","key":"ref14","doi-asserted-by":"crossref","first-page":"075021","DOI":"10.1088\/1361-6641\/ac008b","volume":"36","author":"Ding","year":"2021","journal-title":"Semiconductor Science and Technology"},{"key":"ref15","first-page":"293","volume-title":"International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)","author":"Medina-Bailon"}],"event":{"name":"2021 IEEE 14th International Conference on ASIC (ASICON)","location":"Kunming, China","start":{"date-parts":[[2021,10,26]]},"end":{"date-parts":[[2021,10,29]]}},"container-title":["2021 IEEE 14th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9620208\/9620199\/09620465.pdf?arnumber=9620465","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,11]],"date-time":"2024-09-11T05:59:15Z","timestamp":1726034355000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9620465\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,10,26]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/asicon52560.2021.9620465","relation":{},"subject":[],"published":{"date-parts":[[2021,10,26]]}}}