{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T23:21:36Z","timestamp":1725751296614},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,24]]},"DOI":"10.1109\/asicon58565.2023.10396300","type":"proceedings-article","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T18:33:59Z","timestamp":1706121239000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["Transmitter IC Enabling Magnetic Field Shaping for High-Efficiency Wireless Charging of Multiple Receivers"],"prefix":"10.1109","author":[{"given":"Hao","family":"Qiu","sequence":"first","affiliation":[{"name":"Nanjing University,School of Electronic Science and Engineering, Engineering Research Center of Opto-Electro Materials and Chip Techniques,Nanjing,China,210023"}]},{"given":"Xusheng","family":"Zhang","sequence":"additional","affiliation":[{"name":"Nanjing University,School of Electronic Science and Engineering, Engineering Research Center of Opto-Electro Materials and Chip Techniques,Nanjing,China,210023"}]},{"given":"Junji","family":"Chen","sequence":"additional","affiliation":[{"name":"Nanjing University,School of Electronic Science and Engineering, Engineering Research Center of Opto-Electro Materials and Chip Techniques,Nanjing,China,210023"}]},{"given":"Yi","family":"Shi","sequence":"additional","affiliation":[{"name":"Nanjing University,School of Electronic Science and Engineering, Engineering Research Center of Opto-Electro Materials and Chip Techniques,Nanjing,China,210023"}]},{"given":"Makoto","family":"Takamiya","sequence":"additional","affiliation":[{"name":"The University of Tokyo,Institute of Industrial Science,Tokyo,Japan,153-8505"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2018.2835378"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.2990976"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2387832"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2921449"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3035429"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2767181"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2961852"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2406673"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3183174"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492440"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067347"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2021.3104883"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2017.2673816"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2789168.2790092"}],"event":{"name":"2023 IEEE 15th International Conference on ASIC (ASICON)","start":{"date-parts":[[2023,10,24]]},"location":"Nanjing, China","end":{"date-parts":[[2023,10,27]]}},"container-title":["2023 IEEE 15th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10395907\/10395930\/10396300.pdf?arnumber=10396300","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,14]],"date-time":"2024-03-14T00:58:50Z","timestamp":1710377930000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10396300\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,24]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/asicon58565.2023.10396300","relation":{},"subject":[],"published":{"date-parts":[[2023,10,24]]}}}