{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,5]],"date-time":"2025-11-05T06:56:34Z","timestamp":1762325794122},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,24]]},"DOI":"10.1109\/asicon58565.2023.10396353","type":"proceedings-article","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T18:33:59Z","timestamp":1706121239000},"source":"Crossref","is-referenced-by-count":3,"title":["Ultra-low-power and High-accuracy CMOS Temperature Sensor"],"prefix":"10.1109","author":[{"given":"Jing","family":"Li","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]},{"given":"Luhan","family":"Yang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]},{"given":"Dongjian","family":"Chen","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]},{"given":"Zhong","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]},{"given":"Qihui","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]},{"given":"Ning","family":"Ning","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]},{"given":"Qi","family":"Yu","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,StateKey Laboratory of Electronic Thin Films and Integrated Devices,Chengdu,China,610054"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1007\/978-3-030-95284-6_1","article-title":"Introduction","volume-title":"Resistor-based Temperature Sensors in CMOS Technology","author":"Pan","year":"2022"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952855"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.858476"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-017-04705-6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3042825"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3276196"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2598765"}],"event":{"name":"2023 IEEE 15th International Conference on ASIC (ASICON)","location":"Nanjing, China","start":{"date-parts":[[2023,10,24]]},"end":{"date-parts":[[2023,10,27]]}},"container-title":["2023 IEEE 15th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10395907\/10395930\/10396353.pdf?arnumber=10396353","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,14]],"date-time":"2024-03-14T00:59:08Z","timestamp":1710377948000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10396353\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,24]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/asicon58565.2023.10396353","relation":{},"subject":[],"published":{"date-parts":[[2023,10,24]]}}}