{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,16]],"date-time":"2026-01-16T07:39:54Z","timestamp":1768549194613,"version":"3.49.0"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,24]]},"DOI":"10.1109\/asicon58565.2023.10396357","type":"proceedings-article","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T13:33:59Z","timestamp":1706103239000},"page":"1-4","source":"Crossref","is-referenced-by-count":0,"title":["A Novel TFET-MOSFET Hybrid SRAM for Ultra-Low-Power Applications"],"prefix":"10.1109","author":[{"given":"Renjie","family":"Wei","sequence":"first","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Kaifeng","family":"Wang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Zhixuan","family":"Wang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Libo","family":"Yang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Fangxing","family":"Zhang","sequence":"additional","affiliation":[{"name":"Peking University,School of Electronic and Computer Engineering,Shenzhen,China"}]},{"given":"Yongqin","family":"Wu","sequence":"additional","affiliation":[{"name":"Semiconductor Technology Innovation Center (Beijing),Beijing,China"}]},{"given":"Ye","family":"Ren","sequence":"additional","affiliation":[{"name":"Semiconductor Technology Innovation Center (Beijing),Beijing,China"}]},{"given":"Le","family":"Ye","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Lining","family":"Zhang","sequence":"additional","affiliation":[{"name":"Peking University,School of Electronic and Computer Engineering,Shenzhen,China"}]},{"given":"Weihai","family":"Bu","sequence":"additional","affiliation":[{"name":"Semiconductor Technology Innovation Center (Beijing),Beijing,China"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Qianqian","family":"Huang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]}],"member":"263","event":{"name":"2023 IEEE 15th International Conference on ASIC (ASICON)","location":"Nanjing, China","start":{"date-parts":[[2023,10,24]]},"end":{"date-parts":[[2023,10,27]]}},"container-title":["2023 IEEE 15th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10395907\/10395930\/10396357.pdf?arnumber=10396357","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T13:34:56Z","timestamp":1706103296000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10396357\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,24]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/asicon58565.2023.10396357","relation":{},"subject":[],"published":{"date-parts":[[2023,10,24]]}}}