{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,14]],"date-time":"2026-01-14T19:43:20Z","timestamp":1768419800623,"version":"3.49.0"},"reference-count":7,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,24]]},"DOI":"10.1109\/asicon58565.2023.10396358","type":"proceedings-article","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T13:33:59Z","timestamp":1706103239000},"page":"1-4","source":"Crossref","is-referenced-by-count":3,"title":["High Frame Rate High Precision ROIC with Pixel-level CCO-Based ADC for Infrared FPAs"],"prefix":"10.1109","author":[{"given":"Haolin","family":"Lu","sequence":"first","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Ye","family":"Zhou","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Wengao","family":"Lu","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Yacong","family":"Zhang","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]},{"given":"Zhongjian","family":"Chen","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON52560.2021.9620518"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3231427"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2914191"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2016.2599181"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LPT.2016.2560804"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MSSC.2020.2987536"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2875867"}],"event":{"name":"2023 IEEE 15th International Conference on ASIC (ASICON)","location":"Nanjing, China","start":{"date-parts":[[2023,10,24]]},"end":{"date-parts":[[2023,10,27]]}},"container-title":["2023 IEEE 15th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10395907\/10395930\/10396358.pdf?arnumber=10396358","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,12,2]],"date-time":"2025-12-02T18:43:17Z","timestamp":1764700997000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10396358\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,24]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/asicon58565.2023.10396358","relation":{},"subject":[],"published":{"date-parts":[[2023,10,24]]}}}