{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,21]],"date-time":"2026-01-21T15:54:53Z","timestamp":1769010893776,"version":"3.49.0"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,24]]},"DOI":"10.1109\/asicon58565.2023.10396386","type":"proceedings-article","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T13:33:59Z","timestamp":1706103239000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Temperature Dependent Optimization for Specific On-Resistance for 900 V Superjunction MOSFETs: Numerical Calculation and Comparison"],"prefix":"10.1109","author":[{"given":"Zonghao","family":"Zhang","sequence":"first","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Xi","family":"Wang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Keqiang","family":"Ma","sequence":"additional","affiliation":[{"name":"Chengdu Semi-Future Technology Co. Ltd, China,Chengdu,China,611730"}]},{"given":"Siliang","family":"Wang","sequence":"additional","affiliation":[{"name":"Chengdu Semi-Future Technology Co. Ltd, China,Chengdu,China,611730"}]},{"given":"Chenxing","family":"Wang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Haoyang","family":"Zhou","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Haimeng","family":"Huang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Junji","family":"Cheng","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Bo","family":"Yi","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]},{"given":"Hongqiang","family":"Yang","sequence":"additional","affiliation":[{"name":"University of Electronic Science and Technology of China,Chengdu,China,610054"}]}],"member":"263","event":{"name":"2023 IEEE 15th International Conference on ASIC (ASICON)","location":"Nanjing, China","start":{"date-parts":[[2023,10,24]]},"end":{"date-parts":[[2023,10,27]]}},"container-title":["2023 IEEE 15th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10395907\/10395930\/10396386.pdf?arnumber=10396386","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T13:34:55Z","timestamp":1706103295000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10396386\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,24]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/asicon58565.2023.10396386","relation":{},"subject":[],"published":{"date-parts":[[2023,10,24]]}}}