{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T12:14:30Z","timestamp":1725711270625},"reference-count":9,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,24]],"date-time":"2023-10-24T00:00:00Z","timestamp":1698105600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,24]]},"DOI":"10.1109\/asicon58565.2023.10396644","type":"proceedings-article","created":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T18:33:59Z","timestamp":1706121239000},"page":"1-3","source":"Crossref","is-referenced-by-count":0,"title":["Intelligent Multimodal Sensors Based on Novel Electronic-Ionic Bi<sub>2<\/sub>O<sub>2<\/sub>Se Semiconductors"],"prefix":"10.1109","author":[{"given":"Xinrui","family":"Guo","sequence":"first","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}]},{"given":"Lei","family":"Xu","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}]},{"given":"Qifeng","family":"Cai","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}]},{"given":"Shuo","family":"Liu","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}]},{"given":"Junling","family":"Liu","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}]},{"given":"Ming","family":"He","sequence":"additional","affiliation":[{"name":"Peking University,School of Integrated Circuits,Beijing,China,100871"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-023-00950-y"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-023-36935-w"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202200213"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1038\/d41586-020-00592-6"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1021\/accountsmr.1c00130"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2021.3073418"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371896"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/EDTM55494.2023.10103057"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-TSA54299.2022.9770982"}],"event":{"name":"2023 IEEE 15th International Conference on ASIC (ASICON)","start":{"date-parts":[[2023,10,24]]},"location":"Nanjing, China","end":{"date-parts":[[2023,10,27]]}},"container-title":["2023 IEEE 15th International Conference on ASIC (ASICON)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10395907\/10395930\/10396644.pdf?arnumber=10396644","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T07:47:11Z","timestamp":1706773631000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10396644\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,24]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/asicon58565.2023.10396644","relation":{},"subject":[],"published":{"date-parts":[[2023,10,24]]}}}