{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,18]],"date-time":"2026-06-18T16:11:42Z","timestamp":1781799102285,"version":"3.54.5"},"reference-count":37,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T00:00:00Z","timestamp":1705881600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T00:00:00Z","timestamp":1705881600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,1,22]]},"DOI":"10.1109\/asp-dac58780.2024.10473875","type":"proceedings-article","created":{"date-parts":[[2024,3,25]],"date-time":"2024-03-25T19:06:53Z","timestamp":1711393613000},"page":"758-764","source":"Crossref","is-referenced-by-count":14,"title":["Exploiting 2.5D\/3D Heterogeneous Integration for AI Computing"],"prefix":"10.1109","author":[{"given":"Zhenyu","family":"Wang","sequence":"first","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingbo","family":"Sun","sequence":"additional","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Alper","family":"Goksoy","sequence":"additional","affiliation":[{"name":"University of Wisconsin&#x2013;Madison,Department of Electrical and Computer Engineering,Madison,WI,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sumit K.","family":"Mandal","sequence":"additional","affiliation":[{"name":"Indian Institute of Science,Department of Computer Science and Automation,Bangalore,India"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yaotian","family":"Liu","sequence":"additional","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jae-Sun","family":"Seo","sequence":"additional","affiliation":[{"name":"Cornell Tech,Department of Electrical and Computing Engineering,NY,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chaitali","family":"Chakrabarti","sequence":"additional","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Umit Y.","family":"Ogras","sequence":"additional","affiliation":[{"name":"University of Wisconsin&#x2013;Madison,Department of Electrical and Computer Engineering,Madison,WI,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vidya","family":"Chhabria","sequence":"additional","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jeff","family":"Zhang","sequence":"additional","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,Tempe,AZ,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yu","family":"Cao","sequence":"additional","affiliation":[{"name":"University of Minnesota,Department of Electrical and Computer Engineering,Twin Cities,MN,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019406"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-52548-8"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10181835"},{"key":"ref4","first-page":"SC2","article-title":"Heterogeneous system partitioning and the 3d interconnect technology landscape","volume-title":"2020 Symposia on VLSI technology and Circuits","author":"Beyne"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/iedm13553.2020.9372120"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2016.7799847"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2022.3169899"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3476999"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358302"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3111857"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED51717.2021.9424344"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310173"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA45697.2020.00083"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.2000.910714"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2016.2544837"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC48104.2019.9058895"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993637"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.201"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960207"},{"key":"ref20","first-page":"802","article-title":"Floatpim: In-memory acceleration of deep neural network training with high precision","volume-title":"Proceedings of the 46th International Symposium on Computer Architecture","author":"Imani"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2022.3197516"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001139"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.23919\/DATE56975.2023.10137076"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3069011"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2789723"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101892"},{"key":"ref27","first-page":"1","article-title":"Big-little chiplets for in-memory acceleration of dnns: A scalable heterogeneous architecture","volume-title":"Proceedings of the 41st IEEE\/ACM International Conference on Computer-Aided Design","author":"Krishnan"},{"key":"ref28","first-page":"q1","article-title":"Booksim 2.0 user\u2019s guide","author":"Jiang","year":"2010","journal-title":"Standford University"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/LES.2015.2402197"},{"key":"ref30","first-page":"16","article-title":"Nirgam: a simulator for noc interconnect routing and application modeling","volume-title":"Design, automation and test in Europe conference","author":"Jain"},{"key":"ref31","article-title":"Ratatoskr: An open-source framework for in-depth power, performance and area analysis in 3d nocs","author":"Joseph","year":"2019","journal-title":"arXiv preprint arXiv:1912.05670"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/3371277"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2611497"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.3021358"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.2172\/1407078"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2004.1382591"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.804385"}],"event":{"name":"2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)","location":"Incheon, Korea, Republic of","start":{"date-parts":[[2024,1,22]]},"end":{"date-parts":[[2024,1,25]]}},"container-title":["2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10473777\/10473787\/10473875.pdf?arnumber=10473875","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T19:28:47Z","timestamp":1711999727000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10473875\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1,22]]},"references-count":37,"URL":"https:\/\/doi.org\/10.1109\/asp-dac58780.2024.10473875","relation":{},"subject":[],"published":{"date-parts":[[2024,1,22]]}}}