{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T20:54:47Z","timestamp":1725742487039},"reference-count":14,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T00:00:00Z","timestamp":1705881600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T00:00:00Z","timestamp":1705881600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,1,22]]},"DOI":"10.1109\/asp-dac58780.2024.10473886","type":"proceedings-article","created":{"date-parts":[[2024,3,25]],"date-time":"2024-03-25T19:06:53Z","timestamp":1711393613000},"page":"644-650","source":"Crossref","is-referenced-by-count":0,"title":["ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning"],"prefix":"10.1109","author":[{"given":"Hyunsu","family":"Chae","sequence":"first","affiliation":[{"name":"The University of Texas at Austin,ECE Department,Austin,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Keren","family":"Zhu","sequence":"additional","affiliation":[{"name":"The University of Texas at Austin,ECE Department,Austin,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bhyrav","family":"Mutnury","sequence":"additional","affiliation":[{"name":"Dell Infrastructure Solutions Group,Round Rock,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zixuan","family":"Jiang","sequence":"additional","affiliation":[{"name":"The University of Texas at Austin,ECE Department,Austin,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniel","family":"De Araujo","sequence":"additional","affiliation":[{"name":"Electronic Board Systems, Siemens EDA,Austin,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Douglas","family":"Wallace","sequence":"additional","affiliation":[{"name":"Dell Infrastructure Solutions Group,Round Rock,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Douglas","family":"Winterberg","sequence":"additional","affiliation":[{"name":"Dell Infrastructure Solutions Group,Round Rock,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Adam","family":"Klivans","sequence":"additional","affiliation":[{"name":"The University of Texas at Austin,CS Department,Austin,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David Z.","family":"Pan","sequence":"additional","affiliation":[{"name":"The University of Texas at Austin,ECE Department,Austin,TX,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.3390\/ma14185342"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2019.8825227"},{"article-title":"Hyperparameter optimization: A spectral approach","volume-title":"Proc. ICLR","author":"Hazan","key":"ref3"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.23919\/DATE56975.2023.10137055"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-031-13074-8_12"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3489517.3530514"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2011.2106850"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586136"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3582078"},{"article-title":"Robust multi-objective bayesian optimization under input noise","volume-title":"Proc. ICML","author":"Daulton","key":"ref10"},{"volume-title":"Specification for base materials for rigid and multilayer printed boards","year":"2014","key":"ref11"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1002\/9781118445112.stat06558"},{"volume-title":"A case for new neural network smoothness constraints","year":"2020","author":"Rosca","key":"ref13"},{"key":"ref14","article-title":"Quasi-monte carlo sampling","author":"Owen","year":"2003","journal-title":"Monte Carlo Ray Tracing: Siggraph"}],"event":{"name":"2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)","start":{"date-parts":[[2024,1,22]]},"location":"Incheon, Korea, Republic of","end":{"date-parts":[[2024,1,25]]}},"container-title":["2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10473777\/10473787\/10473886.pdf?arnumber=10473886","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,26]],"date-time":"2024-03-26T22:03:05Z","timestamp":1711490585000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10473886\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1,22]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/asp-dac58780.2024.10473886","relation":{},"subject":[],"published":{"date-parts":[[2024,1,22]]}}}