{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T10:53:00Z","timestamp":1730199180318,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008,1]]},"DOI":"10.1109\/aspdac.2008.4484038","type":"proceedings-article","created":{"date-parts":[[2008,4,10]],"date-time":"2008-04-10T14:56:31Z","timestamp":1207839391000},"page":"67-70","source":"Crossref","is-referenced-by-count":2,"title":["Statistical power profile correlation for realistic thermal estimation"],"prefix":"10.1109","author":[{"given":"Love","family":"Singhal","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sejong","family":"Oh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Eli","family":"Bozorgzadeh","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","article-title":"a case for thermal-aware floorplanning at the microarchitectural level","volume":"7","author":"sankaranarayanan","year":"2006","journal-title":"Journal of Instruction-Level Parallelism"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.357998"},{"year":"0","key":"10"},{"key":"1","first-page":"2","article-title":"temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proceedings of ISCA"},{"journal-title":"Cluster Analysis for Researchers","year":"1984","author":"romesburg","key":"7"},{"key":"6","first-page":"253","article-title":"cell-level placement for improving substrate thermal distribution","volume":"19","author":"tsai","year":"2000","journal-title":"IEEE TCAD"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2007.364517"},{"key":"4","first-page":"1288","article-title":"microarchitectural floorplanning under performance and thermal tradeoff","author":"healy","year":"2006","journal-title":"Proc of DATE"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1145\/996566.996572"}],"event":{"name":"13th Asia and South Pacific Design Automation Conference ASP-DAC 2008","start":{"date-parts":[[2008,3,21]]},"location":"Seoul","end":{"date-parts":[[2008,3,24]]}},"container-title":["2008 Asia and South Pacific Design Automation Conference"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4480121\/4483913\/04484038.pdf?arnumber=4484038","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,5,7]],"date-time":"2020-05-07T21:47:00Z","timestamp":1588888020000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4484038\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008,1]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/aspdac.2008.4484038","relation":{},"subject":[],"published":{"date-parts":[[2008,1]]}}}