{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,17]],"date-time":"2025-06-17T16:28:04Z","timestamp":1750177684491,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2011,1]]},"DOI":"10.1109\/aspdac.2011.5722290","type":"proceedings-article","created":{"date-parts":[[2011,3,5]],"date-time":"2011-03-05T12:54:28Z","timestamp":1299329668000},"page":"760-765","source":"Crossref","is-referenced-by-count":5,"title":["Design constraint of fine grain supply voltage control LSI"],"prefix":"10.1109","author":[{"given":"Atsuki","family":"Inoue","sequence":"first","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2006.4380809"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ICASIC.2005.1611299"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.1994.594099"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2004.46"},{"key":"ref14","first-page":"12","article-title":"High-speed electrical signaling: Overview and Limitations","author":"horowitz","year":"1994","journal-title":"Micro IEEE"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2014201"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2005.1493907"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/313817.313908"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/9780470545058"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2010.5560313"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2006.1696281"},{"key":"ref7","first-page":"1?252","article-title":"Energy-effective design & implementation of an embedded VLIW DSP","author":"hsieh","year":"2008","journal-title":"Proceedings of ISOCC'08"},{"journal-title":"International Technology Roadmap for Semiconductors (ITRS)","year":"2009","key":"ref2"},{"key":"ref1","first-page":"114","article-title":"Cramming more components onto integrated circuits","volume":"38","author":"moore","year":"1965","journal-title":"Electronics"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LPE.2004.1349303"}],"event":{"name":"2011 16th Asia and South Pacific Design Automation Conference ASP-DAC 2011","start":{"date-parts":[[2011,1,25]]},"location":"Yokohama, Japan","end":{"date-parts":[[2011,1,28]]}},"container-title":["16th Asia and South Pacific Design Automation Conference (ASP-DAC 2011)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5716646\/5722157\/05722290.pdf?arnumber=5722290","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T01:55:01Z","timestamp":1490061301000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5722290\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2011,1]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/aspdac.2011.5722290","relation":{},"subject":[],"published":{"date-parts":[[2011,1]]}}}